- 专利标题： METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS DISPOSED
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申请号： US17860392申请日： 2022-07-08
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公开(公告)号： US20240014168A1公开(公告)日： 2024-01-11
- 发明人: Wu-Der YANG
- 申请人： NANYA TECHNOLOGY CORPORATION
- 申请人地址： TW NEW TAIPEI CITY
- 专利权人： NANYA TECHNOLOGY CORPORATION
- 当前专利权人： NANYA TECHNOLOGY CORPORATION
- 当前专利权人地址： TW NEW TAIPEI CITY
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/56
摘要：
The present disclosure provides a method of manufacturing a semiconductor device. The method includes providing a substrate. The method also includes attaching an electronic component to the substrate. The method further includes attaching a fixing feature to an upper surface of the electronic component. In addition, the method includes forming a bonding wire connecting the substrate and the electronic component. The bonding wire is at least partially disposed on the fixing feature.
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