Invention Publication
- Patent Title: RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
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Application No.: US18473336Application Date: 2023-09-25
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Publication No.: US20240015914A1Publication Date: 2024-01-11
- Inventor: Yoshihiro DAIMON , Takashi YAMADA , Hiromichi KITAJIMA , Kiyoshi AIKAWA , Takanori UEJIMA
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-shi
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo-shi
- Priority: JP 21060081 2021.03.31
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/14 ; H05K1/18 ; H05K1/02 ; H05K1/14 ; H05K7/20

Abstract:
A radio-frequency module includes a module substrate having major surfaces; a module substrate having major surfaces, the major surface being disposed facing the major surface; and plural electronic components disposed between the major surfaces, on the major surface, and on the major surface. The plural electronic components include: a first electronic component including the power amplifier; a second electronic component including a low-noise amplifier; a switch that switches connection and disconnection between a first filter and the power amplifier; and a third electronic component including a PA controller to control the power amplifier or a switch controller to control the switch. The first to third electronic components are separately disposed on the major surface, between the major surfaces, and on the major surface.
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