Invention Publication
- Patent Title: COMPOUNDS AND PHOTORESIST COMPOSITIONS INCLUDING THE SAME
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Application No.: US17749880Application Date: 2022-05-20
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Publication No.: US20240019779A1Publication Date: 2024-01-18
- Inventor: Li Cui , Emad Aqad , Yinjie Cen , Conner A. Hoelzel , James F. Cameron , Jong Keun Park , Suzanne M. Coley , Choong-Bong Lee
- Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Applicant Address: US MA Marlborough
- Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee Address: US MA Marlborough
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C07C317/22 ; C07C69/78
Abstract:
A compound represented by Formula (1):
wherein X is a group having a valency of r; each R1 is independently an organic group comprising an acid-labile group; m is an integer greater than or equal to 1; k is an integer from 1 to 5; and r is an integer from 2 to 10, wherein the compound is non-polymeric, and wherein Ar1, L1, L2, R2, and R3 are as defined herein.
wherein X is a group having a valency of r; each R1 is independently an organic group comprising an acid-labile group; m is an integer greater than or equal to 1; k is an integer from 1 to 5; and r is an integer from 2 to 10, wherein the compound is non-polymeric, and wherein Ar1, L1, L2, R2, and R3 are as defined herein.
Information query
IPC分类:
