Invention Publication
- Patent Title: CONFORMAL MOLYBDENUM DEPOSITION
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Application No.: US18222589Application Date: 2023-07-17
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Publication No.: US20240026529A1Publication Date: 2024-01-25
- Inventor: Srinivas Gandikota , Tuerxun Ailihumaer , Yixiong Yang , Seshadri Ganguli , Yogesh Sharma
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C23C16/08
- IPC: C23C16/08 ; C23C16/02 ; C23C16/04

Abstract:
Embodiments of the disclosure provide conformally deposited molybdenum films having reduced resistivity and methods of forming the same. The methods include converting an amorphous silicon layer to a metal layer by thermally soaking the amorphous silicon layer comprising silicon atoms in the presence of a metal compound selected from the group consisting of a molybdenum compound and a tungsten compound until at least a portion of the silicon atoms in the amorphous silicon layer are replaced by metal atoms selected from the group consisting of molybdenum atoms and tungsten atoms. The methods include conformally depositing a molybdenum film on the metal layer.
Information query
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