Invention Publication
- Patent Title: FUNCTIONAL PANEL, METHOD FOR MANUFACTURING THE SAME, MODULE, DATA PROCESSING DEVICE
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Application No.: US18376502Application Date: 2023-10-04
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Publication No.: US20240032232A1Publication Date: 2024-01-25
- Inventor: Shunpei YAMAZAKI , Kohei YOKOYAMA , Yoshiharu HIRAKATA
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi-shi
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Atsugi-shi
- Priority: JP 14219065 2014.10.28 JP 14219066 2014.10.28
- Main IPC: H05K7/02
- IPC: H05K7/02 ; G09F9/00 ; H01L23/10 ; H10K50/84 ; H10K50/844 ; H10K50/852

Abstract:
A novel, highly convenient or reliable functional panel is provided. A novel, highly convenient or reliable method for manufacturing a functional panel is provided. The functional panel includes a first base; a second base having a region overlapping with the first base; a bonding layer that bonds the first base to the second base; and an insulating layer in contact with the first base, the second base, and the bonding layer. With this structure, an opening which is formed easily in a region where the bonding layer is in contact with the first base or the second base can be filled with the insulating layer, which can prevent impurities from being diffused into the functional layer located in a region surrounded by the first base, the second base, and the bonding layer that bonds the first base to the second base.
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