- 专利标题： THERMALLY CONDUCTIVE COMPOSITION
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申请号： US18257056申请日： 2022-05-24
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公开(公告)号： US20240052224A1公开(公告)日： 2024-02-15
- 发明人: Naoki MINORIKAWA , Hajime FUNAHASHI , Hikaru SATOH , Hajime YUKUTAKE
- 申请人： Resonac Corporation
- 申请人地址： JP Tokyo
- 专利权人： Resonac Corporation
- 当前专利权人： Resonac Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP 21139034 2021.08.27
- 国际申请： PCT/JP2022/021189 2022.05.24
- 进入国家日期： 2023-06-12
- 主分类号： C09K5/14
- IPC分类号： C09K5/14 ; C09C3/00 ; C09C3/12 ; C09C3/08 ; C09C1/40 ; C08K9/06
摘要：
A thermally conductive composition comprising: a filler; and a polymer component, wherein the filler comprises at least one surface-treated filler selected from the group consisting of the following filler (A) and filler (B):
Filler (A): A filler surface-treated by a chemical vapor deposition method using a siloxane having one SiH group
Filler (B): A filler surface-treated by a chemical vapor deposition method using a siloxane having two or more SiH groups, wherein at least one group selected from the group consisting of an unsubstituted alkyl group having 6 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms having a substituent, and a group having a specific structure is further bonded to a silicon atom on a surface of the filler and introduced.
Filler (A): A filler surface-treated by a chemical vapor deposition method using a siloxane having one SiH group
Filler (B): A filler surface-treated by a chemical vapor deposition method using a siloxane having two or more SiH groups, wherein at least one group selected from the group consisting of an unsubstituted alkyl group having 6 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms having a substituent, and a group having a specific structure is further bonded to a silicon atom on a surface of the filler and introduced.
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