- 专利标题： AGGREGATED BORON NITRIDE PARTICLES, BORON NITRIDE POWDER, HEAT-CONDUCTIVE RESIN COMPOSITION, AND HEAT-DISSIPATION SHEET
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申请号： US18271129申请日： 2021-12-28
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公开(公告)号： US20240052226A1公开(公告)日： 2024-02-15
- 发明人: Kosuke WADA , Kiyotaka FUJI
- 申请人： DENKA COMPANY LIMITED
- 申请人地址： JP Tokyo
- 专利权人： DENKA COMPANY LIMITED
- 当前专利权人： DENKA COMPANY LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP 21000874 2021.01.06
- 国际申请： PCT/JP2021/048887 2021.12.28
- 进入国家日期： 2023-07-06
- 主分类号： C09K5/14
- IPC分类号： C09K5/14
摘要：
Aggregated boron nitride particles in which hexagonal boron nitride primary particles are aggregated and which include an alkyl group-containing silane coupling agent. The present invention can provide boron nitride powder for obtaining a heat-dissipation sheet with excellent thermal conductivity, a heat-dissipation sheet with excellent thermal conductivity, and a method of producing a heat-dissipation sheet with excellent thermal conductivity.
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