公开(公告)号：US20240052226A1

公开(公告)日：2024-02-15

申请号：US18271129

申请日：2021-12-28

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Kiyotaka FUJI

IPC: C09K5/14

CPC classification number: C09K5/14

Abstract: Aggregated boron nitride particles in which hexagonal boron nitride primary particles are aggregated and which include an alkyl group-containing silane coupling agent. The present invention can provide boron nitride powder for obtaining a heat-dissipation sheet with excellent thermal conductivity, a heat-dissipation sheet with excellent thermal conductivity, and a method of producing a heat-dissipation sheet with excellent thermal conductivity.

公开(公告)号：US20240043730A1

公开(公告)日：2024-02-08

申请号：US18266115

申请日：2021-12-17

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Kiyotaka FUJI

IPC: C09K5/14

CPC classification number: C09K5/14

Abstract: A heat dissipation sheet obtained by molding a heat conductive resin composition, the heat dissipation sheet having a partial discharge start voltage of 2800 to 5000 kV/mm. The method for producing the heat dissipation sheet includes a step of blending a resin and a boron nitride powder containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles to prepare a heat conductive resin composition, a step of molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and a step of heating and pressurizing the heat conductive resin composition sheet under a vacuum. Thus, a heat dissipation sheet excellent in heat conductivity and insulation property and a method can produce the heat dissipation sheet.

公开(公告)号：US20230220262A1

公开(公告)日：2023-07-13

申请号：US18008598

申请日：2021-06-11

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Kiyotaka FUJI ,  Yoshitaka TANIGUCHI

IPC: C09K5/14 ,  C08K3/38 ,  C08K7/00 ,  C08J5/18 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08K3/38 ,  C08K7/00 ,  C08J5/18 ,  H05K7/2039 ,  C08K2201/005 ,  C08K2201/001 ,  C08K2003/385 ,  C08J2383/07

Abstract: A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 μm or more; the particle size at the second maximum point is ⅔ or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 μm and a thickness of 0.2 mm or less.

公开(公告)号：US20240026198A1

公开(公告)日：2024-01-25

申请号：US18266099

申请日：2021-12-17

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Kiyotaka FUJI

IPC: C09K5/00 ,  C01B21/064 ,  C08K3/38 ,  C08J5/18 ,  C08J3/20

CPC classification number: C09K5/00 ,  C01B21/064 ,  C08K3/38 ,  C08J5/18 ,  C08J3/203 ,  C01P2004/51 ,  C01P2006/21 ,  C01P2004/50 ,  C01P2004/62 ,  C01P2004/61 ,  C01P2002/76 ,  C01P2006/32 ,  C08K2201/001 ,  C08K2003/385 ,  C08K2201/005 ,  C08J2383/04

Abstract: A boron nitride powder, containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles, the powder having a particle size distribution including at least a first maximum point, a second maximum point at which a particle size is larger than at the first maximum point, and a third maximum point at which a particle size is larger than at the second maximum point. The heat dissipation sheet is obtained by molding a heat conductive resin composition containing the boron nitride powder and a resin. The method for producing a heat dissipation sheet includes blending the boron nitride powder and a resin to prepare a heat conductive resin composition, molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and heating and pressurizing the heat conductive resin composition sheet under a vacuum.

公开(公告)号：US20230220263A1

公开(公告)日：2023-07-13

申请号：US18008631

申请日：2021-06-11

Applicant: DENKA COMPANY LIMITED

Inventor： Kosuke WADA ,  Kiyotaka FUJI ,  Yoshitaka TANIGUCHI

IPC: C09K5/14 ,  C08K3/38 ,  C08K7/00 ,  C08J5/18 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08K3/38 ,  C08K7/00 ,  C08J5/18 ,  H05K7/2039 ,  C08J2383/07 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/005

Abstract: A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 μm or more, the diameter at the second is ⅔ or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.