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公开(公告)号：US20220392824A1
公开(公告)日：2022-12-08
申请号：US17762235
申请日：2020-09-24
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Masahide KANEKO , Ryozo NONOGAKI
IPC: H01L23/373 , H01L23/367
Abstract: A heat-radiating sheet, in which when after sandwiching a heat-radiating grease between a heat-radiating sheet arranged on an aluminum plate and a glass plate, a heat cycle test is performed 100 cycles, an area ratio of an area of the heat-radiating grease after performing the heat cycle test of 100 cycles to an area of the heat-radiating grease before performing the heat cycle test is 1.0 to 2.0. A heat-radiating sheet laminate includes a heat-radiating sheet and a heat-radiating grease layer formed on the surface of the heat-radiating sheet. A structure includes the heat-radiating sheet, a heat-generating element, and the heat-radiating grease intervening between the heat-radiating sheet and the heat-generating element. A heat-radiating treatment method of a heat-generating element includes a step of applying a heat-radiating grease on the heat-radiating sheet and a step of arranging a heat-generating element on the heat-radiating sheet having the heat-radiating grease applied thereon.
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公开(公告)号：US20220278020A1
公开(公告)日：2022-09-01
申请号：US17636482
申请日：2020-08-18
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Masahide KANEKO , Ryozo NONOGAKI
IPC: H01L23/373 , H01L23/42 , C09K5/00
Abstract: A heat-diffusion sheet when a needle electrode having a cone having a height of 3 mm and a bottom surface diameter of 0.75 mm at a distal end section, wherein a 2.0-kV current voltage having a frequency of 60 Hz, is penetrated stepwise every 10 μm but also retained for 60 seconds before the penetration, a distance between the distal end of the needle electrode and an aluminum plate at the time of dielectric breakdown of the heat-diffusion sheet is larger than 0 μm and 80 μm or less, or the needle electrode short-circuits the aluminum plate without dielectric breakdown of the heat-diffusion sheet. The method includes a step of pre-heating a composition for heat-diffusion sheet at a pre-heating temperature lower than a curing starting temperature; and a curing step of heating the composition for heat-diffusion sheet at a temperature of the curing starting temperature or higher while pressurizing the pre-heated composition sheet for heat-diffusion sheet.
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公开(公告)号：US20240043730A1
公开(公告)日：2024-02-08
申请号：US18266115
申请日：2021-12-17
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Kiyotaka FUJI
IPC: C09K5/14
CPC classification number: C09K5/14
Abstract: A heat dissipation sheet obtained by molding a heat conductive resin composition, the heat dissipation sheet having a partial discharge start voltage of 2800 to 5000 kV/mm. The method for producing the heat dissipation sheet includes a step of blending a resin and a boron nitride powder containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles to prepare a heat conductive resin composition, a step of molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and a step of heating and pressurizing the heat conductive resin composition sheet under a vacuum. Thus, a heat dissipation sheet excellent in heat conductivity and insulation property and a method can produce the heat dissipation sheet.
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公开(公告)号：US20230220262A1
公开(公告)日：2023-07-13
申请号：US18008598
申请日：2021-06-11
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Kiyotaka FUJI , Yoshitaka TANIGUCHI
CPC classification number: C09K5/14 , C08K3/38 , C08K7/00 , C08J5/18 , H05K7/2039 , C08K2201/005 , C08K2201/001 , C08K2003/385 , C08J2383/07
Abstract: A heat dissipation sheet having excellent thermal conductance, is a molded thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, wherein the inorganic filler component particle size distribution includes a first maximum point attributable to the first inorganic filler and a second maximum point attributable to the second inorganic filler; the particle size at the first maximum point is 15 μm or more; the particle size at the second maximum point is ⅔ or less the particle size at the first maximum point; and an accumulated amount of the frequency between the peak start and the peak end of the peak having the first maximum point is 50% or more, and which has a surface roughness of from 1.5 to 3.0 μm and a thickness of 0.2 mm or less.
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公开(公告)号：US20220346280A1
公开(公告)日：2022-10-27
申请号：US17762451
申请日：2020-09-24
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Masahide KANEKO , Ryozo NONOGAKI
IPC: H05K7/20
Abstract: A heat-radiating sheet having a volume resistivity of 1.0×109 Ω·cm or more as measured by a direct current voltage of 500 V according to JIS K6911 after being impregnated with an antifreeze containing 98% by mass or more of ethylene glycol at a temperature 25° C. for 250 hours. It is possible to provide a heat-radiating sheet having high tolerance against gasoline and engine oil.
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Patent Agency Ranking
公开(公告)号：US20220344242A1
公开(公告)日：2022-10-27
申请号：US17762502
申请日：2020-09-24
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Masahide KANEKO , Ryozo NONOGAKI
IPC: H01L23/373 , C09K5/14 , C08L83/04 , C08J5/24
Abstract: A heat-radiating sheet, in which a rate of reduction (%) ((R1-R2)/R1×100) of a thermal resistance (R2) (° C./W) of the heat-radiating sheet as measured when tightened at a tightening torque of 6 kgf·cm by using a screw after being impregnated in an antifreeze containing 98% by mass or more of ethylene glycol at a temperature of 25° C. for 500 hours relative to a thermal resistance (R1) (° C./W) of the heat-radiating sheet as measured when tightened at a tightening torque of 6 kgf·cm by using a screw is 30% or less. It is possible to provide a heat-radiating sheet having high tolerance against gasoline and engine oil.
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公开(公告)号：US20250002630A1
公开(公告)日：2025-01-02
申请号：US18710228
申请日：2022-11-10
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Tomoyuki KANAI , Kenji FUKAO , Tatsumi ARAI , Masao ONOZUKA , Takayuki IWASAKI
Abstract: A copolymer contains a (meth)acrylic based monomer unit A having an anionic group, a (meth)acrylic based monomer unit B having a cationic group, and a (meth)acrylic based monomer unit C other than the (meth)acrylic based monomer unit A and the (meth)acrylic based monomer unit B, and the (meth)acrylic based monomer unit C has a weight average molecular weight of 2,000 to 9,000. The surfactant contains the copolymer. The resin composition contains a resin, the surfactant, and an inorganic filler. The heat dissipation sheet contains the resin composition. The present invention can provide a copolymer that is capable of reducing the viscosity of a resin composition containing a resin and an inorganic filler, a surfactant containing the copolymer, a resin composition containing the surfactant and an inorganic filler, and a heat dissipation sheet containing the resin composition.
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8.发明公开公开(公告)号：US20240026198A1
公开(公告)日：2024-01-25
申请号：US18266099
申请日：2021-12-17
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Kiyotaka FUJI
IPC: C09K5/00 , C01B21/064 , C08K3/38 , C08J5/18 , C08J3/20
CPC classification number: C09K5/00 , C01B21/064 , C08K3/38 , C08J5/18 , C08J3/203 , C01P2004/51 , C01P2006/21 , C01P2004/50 , C01P2004/62 , C01P2004/61 , C01P2002/76 , C01P2006/32 , C08K2201/001 , C08K2003/385 , C08K2201/005 , C08J2383/04
Abstract: A boron nitride powder, containing at least an aggregated boron nitride particle formed by an aggregation of hexagonal boron nitride primary particles, the powder having a particle size distribution including at least a first maximum point, a second maximum point at which a particle size is larger than at the first maximum point, and a third maximum point at which a particle size is larger than at the second maximum point. The heat dissipation sheet is obtained by molding a heat conductive resin composition containing the boron nitride powder and a resin. The method for producing a heat dissipation sheet includes blending the boron nitride powder and a resin to prepare a heat conductive resin composition, molding the heat conductive resin composition into a sheet shape to prepare a heat conductive resin composition sheet, and heating and pressurizing the heat conductive resin composition sheet under a vacuum.
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公开(公告)号：US20230220263A1
公开(公告)日：2023-07-13
申请号：US18008631
申请日：2021-06-11
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Kiyotaka FUJI , Yoshitaka TANIGUCHI
CPC classification number: C09K5/14 , C08K3/38 , C08K7/00 , C08J5/18 , H05K7/2039 , C08J2383/07 , C08K2003/385 , C08K2201/001 , C08K2201/005
Abstract: A heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes first and second inorganic fillers, a particle size distribution has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second, the diameter at the first maximum point is 15 μm or more, the diameter at the second is ⅔ or less that at the first, an integrated amount of frequency between a peak start and end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet is obtained by molding the heat-conductive resin composition.
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公开(公告)号：US20250002771A1
公开(公告)日：2025-01-02
申请号：US18710224
申请日：2022-11-10
Applicant: DENKA COMPANY LIMITED
Inventor： Kosuke WADA , Kenji FUKAO , Masao ONOZUKA
IPC: C09K5/14 , C01B21/064 , C08F220/06 , C08K3/38 , C08L83/04
Abstract: The inorganic filler of the present invention has a zeta potential of −15 mV or less at a pH of 7. The heat dissipation member of the present invention contains the inorganic filler of the present invention and a resin. The present invention can provide an inorganic filler that has good dispersibility in a resin, and a heat dissipation member containing the inorganic filler.
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