Invention Publication
- Patent Title: CHIP PACKAGE WITH INTEGRATED EMBEDDED OFF-DIE INDUCTORS
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Application No.: US17896972Application Date: 2022-08-26
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Publication No.: US20240071958A1Publication Date: 2024-02-29
- Inventor: Hong SHI , Li-Sheng WENG , Frank Peter LAMBRECHT , Jing JING , Shuxian WU
- Applicant: XILINX, INC.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L23/00 ; H01L23/498
Abstract:
A chip package and method for fabricating the same are provided that includes embedded off-die inductors coupled in series. One of the off-die inductors is disposed in a redistribution layer formed on a bottom surface of an integrated circuit (IC) die. The other of the series connected off-die inductors is disposed in a substrate of the chip package. The substrate may be either an interposer or a package substrate.
Information query
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