公开(公告)号：US20250079276A1

公开(公告)日：2025-03-06

申请号：US18241140

申请日：2023-08-31

Applicant: Advanced Micro Devices, Inc. ,  XILINX, INC.

Inventor： Manish DUBEY ,  Frank Peter LAMBRECHT ,  Brett P. WILKERSON ,  Deepak Vasant KULKARNI ,  Hemanth Kumar DHAVALESWARAPU ,  Priyal SHAH

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/043 ,  H01L25/065 ,  H05K1/14

Abstract: Disclosed herein is a chip package assembly that includes a package substrate coupled with an integrated circuit die, a stiffener attached to a top surface of the package substrate, and a connector assembly integrated with the stiffener. Both the connector assembly and the stiffener are disposed at a peripheral area of the top surface. The connector assembly includes a bracket and a connector. The connector is configured to connect with one or more optical cables or electrical connectors. The bracket may be formed by a cavity in the stiffener. The bracket may be attached to the top surface of the package substrate. The stiffener may be coupled with the bracket directly or via the connector. Additionally, a frame coupled to the stiffener or a PCB board may be used to secure the bracket in place.

公开(公告)号：US20240071958A1

公开(公告)日：2024-02-29

申请号：US17896972

申请日：2022-08-26

Applicant: XILINX, INC.

Inventor： Hong SHI ,  Li-Sheng WENG ,  Frank Peter LAMBRECHT ,  Jing JING ,  Shuxian WU

IPC: H01L23/64 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/645 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/24 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/24225 ,  H01L2224/73209 ,  H01L2924/1427 ,  H01L2924/30107

Abstract: A chip package and method for fabricating the same are provided that includes embedded off-die inductors coupled in series. One of the off-die inductors is disposed in a redistribution layer formed on a bottom surface of an integrated circuit (IC) die. The other of the series connected off-die inductors is disposed in a substrate of the chip package. The substrate may be either an interposer or a package substrate.