- 专利标题： CHIP PACKAGE STRUCTURE WITH CONDUCTIVE SHIELDING FILM
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申请号： US18388290申请日： 2023-11-09
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公开(公告)号： US20240079381A1公开(公告)日： 2024-03-07
- 发明人: Chen-Hua YU , An-Jhih SU , Jing-Cheng LIN , Po-Hao TSAI
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 分案原申请号： US16159816 2018.10.15
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L23/552 ; H01L23/60 ; H01L25/00 ; H01L25/10
摘要：
A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film has a concave upper surface facing the first ground bump.
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