- 专利标题: LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
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申请号: US18459874申请日: 2023-09-01
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公开(公告)号: US20240079520A1公开(公告)日: 2024-03-07
- 发明人: Liyang ZHANG , Kai CHENG
- 申请人: ENKRIS SEMICONDUCTOR, INC.
- 申请人地址: CN Suzhou
- 专利权人: ENKRIS SEMICONDUCTOR, INC.
- 当前专利权人: ENKRIS SEMICONDUCTOR, INC.
- 当前专利权人地址: CN Suzhou
- 优先权: CN 2211078563.3 2022.09.05
- 主分类号: H01L33/12
- IPC分类号: H01L33/12 ; H01L33/00 ; H01L33/22 ; H01L33/32
摘要:
A light emitting device includes: a first substrate; a light emitting structure layer located on the first substrate; and an insertion layer located on the light emitting structure layer, a surface, away from the light emitting structure layer, of the insertion layer is a roughened surface, and the insertion layer has a protective effect on the light emitting structure layer. In the light emitting device provided by the present disclosure, the surface, away from the light emitting structure layer, of the insertion layer is the roughened surface, and the insertion layer has the protective effect on the light emitting structure layer during a peeling off process, which solves problems of reduced yield and reduced light extraction efficiency of a light emitting device.
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