Invention Publication
- Patent Title: LIQUID COOLING MANIFOLD
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Application No.: US18112743Application Date: 2023-02-22
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Publication No.: US20240081021A1Publication Date: 2024-03-07
- Inventor: Suresh Reddy Yarragunta , Deepu Narasimiah Subhash , Ravi Kumar Kollipara
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Priority: IN 2241050098 2022.09.01
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20
Abstract:
A method includes a liquid cooling manifold cooling a processor component of a system by liquid cooling a first cold plate coupled to the processor component, cooling a memory component of the system by liquid cooling the first cold plate coupled to the memory component, and a liquid cooling a drive component of the system by liquid cooling a second cold plate coupled to the drive component.
Information query
