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公开(公告)号：US20240196569A1
公开(公告)日：2024-06-13
申请号：US18533024
申请日：2023-12-07
Applicant: Micron Technology, Inc.
Inventor： Suresh Reddy Yarragunta , Deepu Narasimiah Subhash
IPC: H05K7/20
CPC classification number: H05K7/20509
Abstract: Methods, systems, and devices for thermal isolation for memory systems are described. The enclosed heatsink architectures may impede heat transfer from a first group of components to a second group components. Some examples include a partition (an air gap or other thermally insulating material) between multiple heatsinks. The heatsinks may each have heat transfer elements with various structures. In some examples, a first heatsink may overlap a second heatsink. The overlapping architecture may increase the size of the heatsink corresponding to the first set of components and increase their rate of heat exchange. In some examples, the heatsink architecture may include upper heatsinks and lower heatsinks. The enclosed heatsink architectures may reduce device overheating and time spent in thermal throttling, as well as improve the life expectancy, durability, efficiency, and performance of the memory devices. Increased efficiency in cooling the device may save energy costs.
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公开(公告)号：US20250028448A1
公开(公告)日：2025-01-23
申请号：US18772878
申请日：2024-07-15
Applicant: Micron Technology, Inc.
Inventor： Kyle J. Wilkins , Suresh Reddy Yarragunta , Deepu Narasimiah Subhash , Koneri Sathyanarayana Guptha Amith
IPC: G06F3/06
Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a thermally conductive material (TCM) to improve thermal energy storage and heat dissipation to improve a data transfer rate. The TCM surrounds the set of memory components and the processing device and is configured to dissipate heat from the processing device and the set of memory components.
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公开(公告)号：US20240268077A1
公开(公告)日：2024-08-08
申请号：US18597310
申请日：2024-03-06
Applicant: Micron Technology, Inc.
IPC: H05K7/20
CPC classification number: H05K7/20409
Abstract: Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.
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公开(公告)号：US20240172398A1
公开(公告)日：2024-05-23
申请号：US18385191
申请日：2023-10-30
Applicant: Micron Technology, Inc.
CPC classification number: H05K7/205 , G06F1/206 , H05K1/0215 , H05K7/20509 , H05K1/18 , H05K2201/09163
Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a triangular shaped metal bracket to improve heat dissipation to improve a data transfer rate. The triangular shaped metal bracket being physically attached to an edge of the PCB at a base portion of the triangular shaped metal bracket. The triangular shaped metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion along with a heat spreader on a primary and secondary side of the bracket. The triangular shaped metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through a vertex portion of the triangular shaped metal bracket.
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公开(公告)号：US20240114660A1
公开(公告)日：2024-04-04
申请号：US18374421
申请日：2023-09-28
Applicant: Micron Technology, Inc.
CPC classification number: H05K7/2039 , H05K5/0047 , H05K5/0213
Abstract: Example embodiments are directed to a solid-state drive (SSD) enclosure design that is adaptable for different printed circuit board assemblies (PCBA). The SSD enclosure design comprises a three-piece construction that includes a top enclosure, a bottom enclosure, and an intermediate structure. The bottom enclosure is coupled to the top enclosure to form a housing for a PCBA having NOT AND (NAND) devices and a controller. The intermediate structure is coupled to the PCBA and positioned between the top enclosure and the bottom enclosure within the housing. The intermediate structure comprises a plurality of heatsinks to transfer heat from the NAND devices and a controller heatsink to transfer heat from the controller, whereby the type and location of the heatsinks can be changed for a different PCBA without having to change the top enclosure or bottom enclosure. The top enclosure can include vents that allow air to flow through.
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Patent Agency Ranking
公开(公告)号：US20240107657A1
公开(公告)日：2024-03-28
申请号：US18204704
申请日：2023-06-01
Applicant: Micron Technology, Inc.
CPC classification number: H05K1/0209 , H05K7/20509 , H05K2201/066 , H05K2201/10159
Abstract: Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.
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公开(公告)号：US20240244779A1
公开(公告)日：2024-07-18
申请号：US18509939
申请日：2023-11-15
Applicant: Micron Technology, Inc.
Inventor： Suresh Reddy Yarragunta , Deepu Narasimiah Subhash
CPC classification number: H05K5/026 , H05K7/20336 , H05K7/2039
Abstract: A number of embodiments of the present disclosure include an solid state drive (SSD) enclosure comprising a first component, wherein the first component is configured to cover a first side of an SSD, a second component; and a third component, wherein the third component is configured receive the second component, wherein the third component is configured to be releasably coupled to the second component, and wherein the second component and the third component are configured to cover a second side of the SSD.
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公开(公告)号：US20240179873A1
公开(公告)日：2024-05-30
申请号：US18510602
申请日：2023-11-15
Applicant: Micron Technology, Inc.
IPC: H05K7/20
CPC classification number: H05K7/205 , H05K7/20409
Abstract: A system with a circuit with components, an enclosure with a top and a bottom, and a heat transfer device. The heat transfer device has an exterior surface with a first portion, a second portion, and a third portion, where the first portion faces opposite the second portion; and an interior surface with a fourth portion, a fifth portion, and a sixth portion, where the fourth portion faces the fifth portion. The first portion configured to thermally couple to the top of the enclosure. The second portion configured to thermally couple to the bottom of the enclosure. The fourth portion configured to couple to a component mounted on a primary side of the circuit board. The fifth portion configured to face a secondary side of the circuit board. The first heat transfer device configured to distribute thermal energy generated from a component to the top and bottom of the enclosure.
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公开(公告)号：US20240081021A1
公开(公告)日：2024-03-07
申请号：US18112743
申请日：2023-02-22
Applicant: Micron Technology, Inc.
CPC classification number: H05K7/20272 , G06F1/20 , H05K7/20254 , H05K7/20281
Abstract: A method includes a liquid cooling manifold cooling a processor component of a system by liquid cooling a first cold plate coupled to the processor component, cooling a memory component of the system by liquid cooling the first cold plate coupled to the memory component, and a liquid cooling a drive component of the system by liquid cooling a second cold plate coupled to the drive component.
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公开(公告)号：US20240069581A1
公开(公告)日：2024-02-29
申请号：US18235169
申请日：2023-08-17
Applicant: Micron Technology, Inc.
Inventor： Suresh Reddy Yarragunta , Deepu Narasimiah Subhash , Ramesh Nallavelli
CPC classification number: G05D23/19 , G06F1/20 , G06F12/0246 , G06F2212/7201
Abstract: Some memory sub-systems are operated in high temperature and low airflow environments. As a safeguard, thermal throttling may limit throughput on a memory sub-system when a predetermined temperature is reached or exceeded. Improving heat dissipation increases the amount of time a memory sub-system can operate without initiating thermal throttling. Adding a phase-change material (PCM) with a melting temperature above the ambient temperature but below the thermal throttling temperature to a memory sub-system increases the amount of heat the memory sub-system can generate before the temperature reaches the thermal throttling temperature. Thermally coupling components with a heat spreading sheet causes the temperature of the components to vary less than when the components transfer heat by air. Thus, a component that generates less heat may be used to absorb heat generated by another component, increasing the amount of time before any component reaches the thermal throttling temperature.
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