Invention Publication
- Patent Title: HIGH DENSITY CARBON FILMS FOR PATTERNING APPLICATIONS
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Application No.: US18507328Application Date: 2023-11-13
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Publication No.: US20240087894A1Publication Date: 2024-03-14
- Inventor: Eswaranand VENKATASUBRAMANIAN , Samuel E. GOTTHEIM , Pramit MANNA , Abhijit B. MALLICK
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/033
- IPC: H01L21/033 ; C23C16/27 ; C23C16/509 ; H01J37/32 ; H01L21/683

Abstract:
Embodiments of the present disclosure generally relate to deposition of high transparency, high-density carbon films for patterning applications. In one embodiment, a method of forming a carbon film on a substrate is provided. The method includes flowing a hydrocarbon-containing gas mixture into a process chamber having a substrate positioned on an electrostatic chuck, wherein the substrate is maintained at a temperature of about −10° C. to about 20° C. and a chamber pressure of about 0.5 mTorr to about 10 Torr, and generating a plasma by applying a first RF bias to the electrostatic chuck to deposit a diamond-like carbon film containing about 60% or greater hybridized sp3 atoms on the substrate, wherein the first RF bias is provided at a power of about 1800 Watts to about 2200 Watts and at a frequency of about 40 MHz to about 162 MHz.
Information query
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