Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US18458050Application Date: 2023-08-29
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Publication No.: US20240098981A1Publication Date: 2024-03-21
- Inventor: Daichi NISHIKAWA , Daisuke IKENO , Atsuko SAKATA
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP 22150044 2022.09.21
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L29/786

Abstract:
According to one embodiment, a semiconductor device includes a pillar of an oxide semiconductor material and a gate insulating layer that surrounds a side surface of the pillar. The gate insulating layer includes a lower portion, an upper portion, and an intermediate portion. A gate electrode surrounds the intermediate portion of the gate insulating layer. A lower electrode is provided that includes a first oxide conductor portion that is connected to a lower surface of the pillar. An upper electrode is provided connected to an upper surface of the pillar. The gate electrode includes a metal portion containing a metallic element and a first nitrogen-containing portion between the metal portion and the gate insulating layer. The first oxide conductor portion includes a second nitrogen-containing at an interface between the first oxide conductor portion and the gate insulating layer.
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