Invention Publication
- Patent Title: METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY
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Application No.: US18488074Application Date: 2023-10-17
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Publication No.: US20240111098A1Publication Date: 2024-04-04
- Inventor: Vineeth ABRAHAM , Wesley MORGAN , Eric MORET , Paul DIGLIO , Srikant NEKKANTY
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G02B6/30
- IPC: G02B6/30 ; G02B6/42

Abstract:
The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.
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