公开(公告)号：US20220011529A1

公开(公告)日：2022-01-13

申请号：US17482485

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Sufi AHMED ,  Vineeth ABRAHAM ,  Eric MORET ,  Paul DIGLIO

IPC: G02B6/42

Abstract: The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.

公开(公告)号：US20240111098A1

公开(公告)日：2024-04-04

申请号：US18488074

申请日：2023-10-17

Applicant: Intel Corporation

Inventor： Vineeth ABRAHAM ,  Wesley MORGAN ,  Eric MORET ,  Paul DIGLIO ,  Srikant NEKKANTY

IPC: G02B6/30 ,  G02B6/42

CPC classification number: G02B6/30 ,  G02B6/4224

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

公开(公告)号：US20220011517A1

公开(公告)日：2022-01-13

申请号：US17482482

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Vineeth ABRAHAM ,  Wesley MORGAN ,  Eric MORET ,  Paul DIGLIO ,  Srikant NEKKANTY

IPC: G02B6/30

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

公开(公告)号：US20230314733A1

公开(公告)日：2023-10-05

申请号：US17710669

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Eric MORET ,  Paul DIGLIO ,  Wesley MORGAN

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/4257

Abstract: Embodiments disclosed herein include an electronic system. In an embodiment, the electronic system comprises a board, and a package substrate coupled to the board. In an embodiment, a photonics integrated circuit (PIC) is coupled to the package substrate. In an embodiment, an optical lens is on the PIC, and an optical connector is on the board. In an embodiment, the optical connector passes through an opening through the package substrate and is optically coupled with the optical lens on the PIC.