Invention Publication
- Patent Title: PACKAGE INTEGRATED MULTIBAND AND POLARIZATION DIVERSIFIED MODE RECONFIGURABLE ANTENNA SYSTEM FOR ROBUST WIRELESS CHIP TO CHIP COMMUNICATION
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Application No.: US17955551Application Date: 2022-09-29
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Publication No.: US20240113438A1Publication Date: 2024-04-04
- Inventor: Zhen ZHOU , Shuhei YAMADA , Renzhi LIU , Tae Young YANG , Tolga ACIKALIN , Kenneth P. FOUST
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01Q9/16
- IPC: H01Q9/16

Abstract:
A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.
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