公开(公告)号：US20240176167A1

公开(公告)日：2024-05-30

申请号：US18071246

申请日：2022-11-29

Applicant: Intel Corporation

Inventor： Benjamin DUONG ,  Kristof DARMAWIKARTA ,  Tolga ACIKALIN ,  Harel FRISH ,  Sandeep GAAN ,  John HECK ,  Eric J. M. MORET ,  Suddhasattwa NAD ,  Haisheng RONG

IPC: G02F1/01 ,  G02B6/125

CPC classification number: G02F1/0113 ,  G02B6/125 ,  G02F1/0147 ,  G02B2006/12145

Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core where the core comprises glass. In an embodiment, the package substrate further comprises an optical waveguide over the core, and an optical phase change material over the optical waveguide.

公开(公告)号：US20150285857A1

公开(公告)日：2015-10-08

申请号：US14746764

申请日：2015-06-22

Applicant: INTEL CORPORATION

Inventor： Christopher R. SCHROEDER ,  Christopher W. ACKERMAN ,  James C. SHIPLEY ,  Tolga ACIKALIN ,  Ioan SAUCIUC ,  Michael L. RUTIGLIANO ,  James G. MAVEETY ,  Ashish GUPTA

IPC: G01R31/28 ,  G01R31/26

CPC classification number: G01R31/2875 ,  F28F3/12 ,  G01R31/2642 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract translation: 测试半导体装置的装置包括保持至少一个传热流体单元的基座。 至少一个传热流体单元包括包括供给孔横截面的流体供应结构以及包括回流孔横截面的流体返回结构。 供应孔横截面大于回流孔横截面。 模具界面也被包括为液体不可渗透的材料。

公开(公告)号：US20230420396A1

公开(公告)日：2023-12-28

申请号：US18253954

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Arnaud AMADJIKPE ,  Brent R. CARLTON ,  Chia-Pin CHIU ,  Timothy F. COX ,  Kenneth P. FOUST ,  Bryce D. HORINE ,  Telesphor KAMGAING ,  Renzhi LIU ,  Jason A. MIX ,  Sai VADLAMANI ,  Tae Young YANG ,  Zhen ZHOU

IPC: H01L23/66 ,  H01Q9/42 ,  H01Q1/22 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01Q9/42 ,  H01Q1/2283 ,  H01Q9/36 ,  H01Q21/24 ,  H01L25/0652 ,  H01L2924/1421 ,  H01L24/16 ,  H01L23/5381 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L25/0655

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

公开(公告)号：US20220199556A1

公开(公告)日：2022-06-23

申请号：US17131863

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Tae Young YANG ,  Tolga ACIKALIN ,  Johanny ESCOBAR PELAEZ ,  Kenneth P. FOUST ,  Chia-Pin CHIU ,  Renzhi LIU ,  Cheng-Yuan CHIN

IPC: H01L23/66 ,  H01L29/93 ,  H01L23/14 ,  H01Q15/00 ,  H01Q1/42 ,  H01Q15/14 ,  H01Q1/22

Abstract: In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.

公开(公告)号：US20240106126A1

公开(公告)日：2024-03-28

申请号：US18352296

申请日：2023-07-14

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Tolga ACIKALIN ,  Kenneth FOUST ,  Shuhei YAMADA ,  Tae Young YANG ,  Timothy F. COX ,  Renzhi LIU ,  Richard DORRANCE ,  Johanny ESCOBAR PELAEZ

IPC: H01Q9/04 ,  H01Q1/22

CPC classification number: H01Q9/0414 ,  H01Q1/2283 ,  H01Q9/045

Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.

公开(公告)号：US20240021522A1

公开(公告)日：2024-01-18

申请号：US18253945

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Tolga ACIKALIN ,  Tae Young YANG ,  Debabani CHOUDHURY ,  Shuhei YAMADA ,  Roya DOOSTNEJAD ,  Hosein NIKOPOUR ,  Issy KIPNIS ,  Oner ORHAN ,  Mehnaz RAHMAN ,  Kenneth P. FOUST ,  Christopher D. HULL ,  Telesphor KAMGAING ,  Omkar KARHADE ,  Stefano PELLERANO ,  Peter SAGAZIO ,  Sai VADLAMANI

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/22

CPC classification number: H01L23/5381 ,  H01L25/0652 ,  H01L24/16 ,  H01L23/66 ,  H01L23/49822 ,  H01Q1/2283 ,  H01L24/81 ,  H01L2924/14222 ,  H01L2924/1431 ,  H01L2223/6677 ,  H01L2223/6616 ,  H01L2223/6655 ,  H01L2224/16235 ,  H01L2224/16146

Abstract: Various devices, systems, and/or methods perform wireless chip to chip high speed data transmission. Strategies for such transmission include use of improved microbump antennas, wireless chip to chip interconnects, precoding and decoding strategies, channel design to achieve spatial multiplexing gain in line of sight transmissions, open cavity chip design for improved transmission, and/or mixed signal channel equalization.

公开(公告)号：US20220413236A1

公开(公告)日：2022-12-29

申请号：US17358502

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Omkar KARHADE ,  Sushrutha Reddy GUJJULA ,  Tolga ACIKALIN ,  Ravindranath V. MAHAJAN ,  James E. JAUSSI ,  Chia-Pin CHIU

IPC: G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  H01L23/367 ,  H01S3/04

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermally and/or electrically coupling a thermal die to the surface of a photonic integrated circuit (PIC) within an open cavity in a substrate, where the thermal die is proximate to a laser on the PIC. Other embodiments may be described and/or claimed.

公开(公告)号：US20240222859A1

公开(公告)日：2024-07-04

申请号：US18147768

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Tae Young YANG ,  Zhen ZHOU ,  Shuhei YAMADA ,  Tolga ACIKALIN ,  Kenneth P. FOUST ,  Bryce D. HORINE

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q17/00 ,  H01Q19/10

CPC classification number: H01Q1/526 ,  H01Q1/2291 ,  H01Q17/00 ,  H01Q19/10

Abstract: An apparatus may include a substrate including: a first antenna configured to form a first short range wireless interconnection with a first antenna of a further substrate, a second antenna spaced apart from the first antenna, the second antenna is configured to form a second short range wireless interconnection with a second antenna of the further substrate, and a metamaterial configured to form a surface with effective negative permeability within a space formed between a surface of the substrate and a surface of the further substrate for an established short range wireless interconnection of the first short range wireless interconnection and the second short range wireless interconnection.

公开(公告)号：US20240113807A1

公开(公告)日：2024-04-04

申请号：US18448183

申请日：2023-08-11

Applicant: Intel Corporation

Inventor： Richard DORRANCE ,  Tolga ACIKALIN ,  Kenneth P. FOUST ,  Renzhi LIU

IPC: H04L1/00 ,  H04W64/00

CPC classification number: H04L1/0044 ,  H04L1/0061 ,  H04L1/0076 ,  H04W64/006 ,  H04W84/18

Abstract: The present disclosure relates to a device which includes a processor configured to: select, using sensor data, an error correction code from two or more error correction codes, the sensor data representing a physical state of the processor and/or the device; generate channel-coded data by channel-coding input data using the selected error correction code; and provide a representation of the channel-coded data to a transmitter for wireless data transmission.

公开(公告)号：US20240113438A1

公开(公告)日：2024-04-04

申请号：US17955551

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Zhen ZHOU ,  Shuhei YAMADA ,  Renzhi LIU ,  Tae Young YANG ,  Tolga ACIKALIN ,  Kenneth P. FOUST

IPC: H01Q9/16

CPC classification number: H01Q9/16

Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.