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公开(公告)号:US20220206064A1
公开(公告)日:2022-06-30
申请号:US17133659
申请日:2020-12-24
Applicant: Intel Corporation
Inventor: Zhen ZHOU , Renzhi LIU , Jong-Ru GUO , Kenneth P. FOUST , Jason A. MIX , Kai XIAO , Zuoguo WU , Daqiao DU
IPC: G01R31/302 , H01P3/08 , H01Q9/16 , H04B5/02 , G01R31/28 , G01R31/303
Abstract: A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.
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公开(公告)号:US20240106126A1
公开(公告)日:2024-03-28
申请号:US18352296
申请日:2023-07-14
Applicant: Intel Corporation
Inventor: Zhen ZHOU , Tolga ACIKALIN , Kenneth FOUST , Shuhei YAMADA , Tae Young YANG , Timothy F. COX , Renzhi LIU , Richard DORRANCE , Johanny ESCOBAR PELAEZ
CPC classification number: H01Q9/0414 , H01Q1/2283 , H01Q9/045
Abstract: A communication system, including a first carrier and a first antenna mounted on the first carrier; a second carrier and a second antenna mounted on the second carrier, wherein the first antenna and the second antenna are arranged relative to each other that the first antenna and the second antenna can establish wireless link; a third carrier and a third antenna mounted on the third carrier; a fourth carrier and a fourth antenna mounted on the fourth carrier, wherein the third antenna and the fourth antenna are arranged relative to each other that the third antenna and the fourth antenna can establish wireless link; and a transmission structure, within which the signal propagate through, connects the second antenna and the third antenna.
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公开(公告)号:US20220200776A1
公开(公告)日:2022-06-23
申请号:US17131862
申请日:2020-12-23
Applicant: Intel Corporation
Inventor: Brent R. CARLTON , Richard DORRANCE , Kenneth P. FOUST , Asma Beevi KURIPARAMBIL THEKKUMPATE , Renzhi LIU , Rinkle JAIN
Abstract: A transceiver may include a transmitter device, a receiver device, a secondary receiver device, and switching elements. The transmitter device may provide a transmit control signal on first and second channels. The receiver device may receive a receive control signal on the first and second channels. The secondary receiver device may monitor occupation of the first and second channels without decoding at least a portion of control signals concurrent with the receiver device receiving the receive control signal. The switching elements may control when the transmitter device provides the transmit control signal to one of and is electrically isolated from first and second antennas, the receiver device receives the receive control signal from one of and is electrically isolated from the first and second antennas, and the secondary receiver device monitors occupation of one of the first and second channels and is electrically isolated from the first and second antennas.
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公开(公告)号:US20250093413A1
公开(公告)日:2025-03-20
申请号:US18963838
申请日:2024-11-29
Applicant: Intel Corporation
Inventor: Zhen ZHOU , Renzhi LIU , Jong-Ru GUO , Kenneth P. FOUST , Jason A. MIX , Kai XIAO , Zuoguo WU , Daqiao DU
IPC: G01R31/302 , G01R31/28 , G01R31/303 , H01P3/08 , H01Q9/16 , H04B5/48
Abstract: A high volume manufacturing (HVM) test system including a test device defining an opening configured to receive a package under test, the test device including an external access agent (EAA) including: a first leaky surface wave launcher for near field wireless communication, the first leaky surface wave launcher configured to wirelessly provide sideband signals to and wirelessly receive the sideband signals from a silicon package agent physically positioned in a separate package as the EAA; and a first transceiver electrically coupled to the first leaky surface wave launcher, the first transceiver configured to: process the sideband signals received by the first leaky surface wave launcher; and generate the sideband signals for wireless transmission by the first leaky surface wave launcher.
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公开(公告)号:US20240113807A1
公开(公告)日:2024-04-04
申请号:US18448183
申请日:2023-08-11
Applicant: Intel Corporation
Inventor: Richard DORRANCE , Tolga ACIKALIN , Kenneth P. FOUST , Renzhi LIU
CPC classification number: H04L1/0044 , H04L1/0061 , H04L1/0076 , H04W64/006 , H04W84/18
Abstract: The present disclosure relates to a device which includes a processor configured to: select, using sensor data, an error correction code from two or more error correction codes, the sensor data representing a physical state of the processor and/or the device; generate channel-coded data by channel-coding input data using the selected error correction code; and provide a representation of the channel-coded data to a transmitter for wireless data transmission.
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公开(公告)号:US20240113438A1
公开(公告)日:2024-04-04
申请号:US17955551
申请日:2022-09-29
Applicant: Intel Corporation
Inventor: Zhen ZHOU , Shuhei YAMADA , Renzhi LIU , Tae Young YANG , Tolga ACIKALIN , Kenneth P. FOUST
IPC: H01Q9/16
CPC classification number: H01Q9/16
Abstract: A package-to-package communication system is provided including a first package having integrated on a first substrate a first antenna, a second antenna, and a first transceiver coupled to the first antenna and the second antenna. The first antenna is arranged along a first edge of the first substrate. The second antenna is arranged along a second edge of the first substrate. A second package having integrated on a second substrate a third antenna, a fourth antenna and a second transceiver coupled to the third antenna and the fourth antenna. The third antenna is arranged along a third edge of the second substrate. The fourth antenna is arranged along a fourth edge of the second substrate. The first antenna and the third antenna are configured to communicate signals of a vertical polarization. The second antenna and the fourth antenna are configured to communicate signals of a horizontal polarization.
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公开(公告)号:US20250112357A1
公开(公告)日:2025-04-03
申请号:US18817279
申请日:2024-08-28
Applicant: Intel Corporation
Inventor: Zhen ZHOU , Tae Young YANG , Shuhei YAMADA , Tolga ACIKALIN , Renzhi LIU , Kenneth FOUST , Bryce HORINE
IPC: H01Q1/22 , H01L23/31 , H01L23/538 , H01L25/00 , H01L25/065 , H01Q1/48 , H01Q5/40 , H01Q9/04
Abstract: The present disclosure relates to a semiconductor package comprising a substrate, a radio frequency integrated circuit attached to the substrate, optionally at least one semiconductor die attached to the substrate and coupled to a radio frequency integrated circuit (RFIC) via one or more signal lines, a molding compound encapsulating the RFIC and the optional semiconductor die, and an antenna formed on the molding compound and coupled to the RFIC.
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公开(公告)号:US20240113698A1
公开(公告)日:2024-04-04
申请号:US17956844
申请日:2022-09-30
Applicant: Intel Corporation
Inventor: Richard DORRANCE , Peter SAGAZIO , Renzhi LIU , Hechen WANG , Deepak DASALUKUNTE , Brent R. CARLTON
IPC: H03H17/02
CPC classification number: H03H17/02 , H03H2218/10
Abstract: A radiofrequency frontend device includes a memory array, which includes a plurality of input lines; a plurality of output lines; and a plurality of impedance devices, each impedance device connecting an input line of the plurality of input lines to an output line of the plurality of output lines, wherein each impedance represents a filter coefficient; wherein the radiofrequency frontend device is configured to provide at each input line of the plurality of input lines a sampled voltage of an analog electric signal, each sampled voltage corresponding to a voltage of the analog electric signal during a respective time period of a plurality of time periods; and when the memory array receives the sampled voltages, the memory array is configured to modify each of the sampled voltages by a respective impedance device of the plurality of impedance devices and sum the modified sampled voltages.
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公开(公告)号:US20230420396A1
公开(公告)日:2023-12-28
申请号:US18253954
申请日:2020-12-23
Applicant: Intel Corporation
Inventor: Tolga ACIKALIN , Arnaud AMADJIKPE , Brent R. CARLTON , Chia-Pin CHIU , Timothy F. COX , Kenneth P. FOUST , Bryce D. HORINE , Telesphor KAMGAING , Renzhi LIU , Jason A. MIX , Sai VADLAMANI , Tae Young YANG , Zhen ZHOU
IPC: H01L23/66 , H01Q9/42 , H01Q1/22 , H01Q9/36 , H01Q21/24 , H01L25/065 , H01L23/00 , H01L23/538
CPC classification number: H01L23/66 , H01Q9/42 , H01Q1/2283 , H01Q9/36 , H01Q21/24 , H01L25/0652 , H01L2924/1421 , H01L24/16 , H01L23/5381 , H01L2223/6677 , H01L2224/16145 , H01L2224/16235 , H01L25/0655
Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.
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公开(公告)号:US20220199556A1
公开(公告)日:2022-06-23
申请号:US17131863
申请日:2020-12-23
Applicant: Intel Corporation
Inventor: Zhen ZHOU , Tae Young YANG , Tolga ACIKALIN , Johanny ESCOBAR PELAEZ , Kenneth P. FOUST , Chia-Pin CHIU , Renzhi LIU , Cheng-Yuan CHIN
Abstract: In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.
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