Invention Publication
- Patent Title: SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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Application No.: US18263920Application Date: 2022-01-24
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Publication No.: US20240120183A1Publication Date: 2024-04-11
- Inventor: Makoto WADA , Ryota IFUKU , Takashi MATSUMOTO , Hiroki YAMADA
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-ku, Tokyo
- Priority: JP 21017751 2021.02.05
- International Application: PCT/JP2022/002309 2022.01.24
- Date entered country: 2023-08-02
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/26 ; C23C16/455 ; C23C16/511 ; C23C16/52 ; H01L21/02

Abstract:
A substrate processing method of processing a substrate includes: a carry-in process of carrying the substrate into a processing container; a first process of forming a first carbon film on the substrate with plasma of a first mixture gas containing a carbon-containing gas in a state in which interior of the processing container is maintained at a first pressure; and a second process of changing a pressure in the processing container to a second pressure higher than the first pressure.
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