Invention Publication
- Patent Title: HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET
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Application No.: US18547409Application Date: 2022-02-08
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Publication No.: US20240124955A1Publication Date: 2024-04-18
- Inventor: Yosuke NAKASATO , Kazunari MAKI , Yasuhiro TSUGAWA , U TANI
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 21032441 2021.03.02
- International Application: PCT/JP2022/004914 2022.02.08
- Date entered country: 2023-08-22
- Main IPC: C22C9/01
- IPC: C22C9/01 ; B22D11/00 ; C22C1/02 ; C22C9/00 ; C22F1/08 ; C23C14/34 ; H01J37/34

Abstract:
This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, Al: 0.4 mass % or more and 5.7 mass % or less, and Ag: 0.01 mass % or less, with a remainder being Cu and inevitable impurities, an area ratio of Cube orientation (area ratio of crystal orientation) measured by an EBSD method is 5% or less, an average KAM value when a boundary between adjacent pixels where an orientation difference between the pixels is 5° or more is regarded as a crystal grain boundary is 2.0 or less, and an average crystal grain size μ in a sheet-thickness central portion is 40 μm or less.
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