- 专利标题: POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
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申请号: US18278402申请日: 2022-03-28
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公开(公告)号: US20240131653A1公开(公告)日: 2024-04-25
- 发明人: Teppei TATENO , Hiroshi KURIHARA , Satsuki YAMAGUCHI , Yamato TAKAMIZAWA , Keisuke OCHI , Tetsuaki KAWASAKI
- 申请人: FUJIBO HOLDINGS, INC.
- 申请人地址: JP Tokyo
- 专利权人: FUJIBO HOLDINGS, INC.
- 当前专利权人: FUJIBO HOLDINGS, INC.
- 当前专利权人地址: JP Tokyo
- 优先权: JP 21056760 2021.03.29
- 国际申请: PCT/JP2022/015347 2022.03.28
- 进入国家日期: 2023-08-21
- 主分类号: B24B37/22
- IPC分类号: B24B37/22
摘要:
This polishing pad has a polishing layer that comprises a polyurethane resin foam derived from an isocyanate-terminated prepolymer and a curing agent, wherein: the distance between hard segments in the polishing layer as measured by small-angle X-ray scattering is 9.5 nm or less; or the ratio (NC80/CC80) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 80° C. to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 80° C. is 2.6-3.1, and the ratio (NC40/CC40) of the content proportion by weight (NC40) of an amorphous phase in the polishing layer as measured by pulse NMR at 40° C. to the content proportion by weight (CC40) of a crystalline phase in the polishing layer as measured by pulse NMR at 40° C. is 0.5-0.9.
公开/授权文献
- US20240227118A9 POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD 公开/授权日:2024-07-11
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