公开(公告)号：US20240149390A1

公开(公告)日：2024-05-09

申请号：US18278405

申请日：2022-03-18

申请人： FUJIBO HOLDINGS, INC.

发明人： Yoshihide KAWAMURA ,  Teppei TATENO ,  Hiroshi KURIHARA ,  Satsuki YAMAGUCHI ,  Yamato TAKAMIZAWA ,  Keisuke OCHI ,  Tetsuaki KAWASAKI

IPC分类号： B24B37/22

CPC分类号： B24B37/22

摘要： Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous phase content in the polishing layer measured at 80° C. by a pulsed NMR method to a weight proportion (NC40) of the amorphous phase content in the polishing layer measured at 40° C. by the pulsed NMR method is between 1.5 and 2.5.

公开(公告)号：US20230415300A1

公开(公告)日：2023-12-28

申请号：US18247158

申请日：2021-09-16

申请人： Fujibo Holdings, Inc.

发明人： Teppei TATENO ,  Keisuke TANAKA ,  Yoshie KIRAKU ,  Kenichi KOIKE ,  Hiroshi KURIHARA ,  Yoshiki MIYAUCHI

IPC分类号： B24B37/24 ,  B24B37/26 ,  C08J7/056 ,  B24D3/22

CPC分类号： B24B37/24 ,  B24D3/22 ,  C08J7/056 ,  B24B37/26

摘要： The present invention provides a polishing pad that can suppress variations in light transmittance or a polishing pad that can reduce adhesion and sticking of polishing swarf to the surface on the polishing surface side of the light-transmitting resin member (window member).

公开(公告)号：US20230173637A1

公开(公告)日：2023-06-08

申请号：US17912937

申请日：2021-03-19

申请人： FUJIBO HOLDINGS, INC.

发明人： Teppei TATENO ,  Ryuma MATSUOKA ,  Hiroshi KURIHARA ,  Satsuki NARUSHIMA ,  Yamato TAKAMIZAWA

IPC分类号： B24B37/22

CPC分类号： B24B37/22

摘要： Provided is a polishing unit that can reduce penetration of a polishing slurry into a base material layer and that can prevent impairment in polishing performance. A polishing unit (10a) in accordance with a first aspect of the present invention includes: a polishing pad (100a) that includes a polishing layer (101) and a base material layer (103); and a surface plate (150), the base material layer (103) having a diameter smaller than a diameter of the polishing layer (101) and greater than a diameter of the surface plate (150).

公开(公告)号：US20210347006A1

公开(公告)日：2021-11-11

申请号：US17278540

申请日：2019-09-27

申请人： FUJIBO HOLDINGS, INC.

发明人： Ryuma MATSUOKA ,  Hiroshi KURIHARA ,  Satsuki NARUSHIMA ,  Yamato TAKAMIZAWA

IPC分类号： B24B37/24 ,  B24B37/22

摘要： An object is to provide a polishing pad that can reduce generation of scratches, and a method for producing a polished product. A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet exhibits a peak of loss tangent tan δ in the range from 40 to 60° C. in dynamic viscoelasticity measurement performed under conditions of a frequency of 1.6 Hz and a temperature of 20 to 100° C. in a water immersion condition.

公开(公告)号：US20240149389A1

公开(公告)日：2024-05-09

申请号：US18282165

申请日：2021-03-22

申请人： FUJIBO HOLDINGS, INC.

发明人： Teppei TATENO ,  Ryuma MATSUOKA ,  Hiroshi KURIHARA ,  Satsuki YAMAGUCHI ,  Yamato TAKAMIZAWA

IPC分类号： B24B37/04 ,  C08J5/18 ,  C08J9/00 ,  C08J9/18

CPC分类号： B24B37/042 ,  C08J5/18 ,  C08J9/0061 ,  C08J9/18 ,  C08J2203/22 ,  C08J2375/08 ,  C08J2433/20 ,  H01L21/30625

摘要： A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet has a ratio (E′B40/E′T40) of a storage elastic modulus E′B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic modulus E′T40 at 40° C. in dynamic viscoelasticity measurement performed under a tension mode condition with a frequency of 1.6 Hz of 0.60 to 1.60.

公开(公告)号：US20230373055A1

公开(公告)日：2023-11-23

申请号：US18029073

申请日：2021-09-27

申请人： FUJIBO HOLDINGS, INC.

发明人： Teppei TATENO ,  Ryuma MATSUOKA ,  Hiroshi KURIHARA ,  Satsuki NARUSHIMA ,  Yamato TAKAMIZAWA

IPC分类号： B24B37/22 ,  B24B37/24

CPC分类号： B24B37/22 ,  B24B37/24

摘要： The present invention relates to a polishing pad including a polishing layer and a cushion layer, wherein a ratio E′B40/E′C40 of a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′B40, to a storage elastic modulus at 40° C. in dynamic viscoelasticity measurement performed under a compression mode condition with a dry state, a frequency of 10 rad/s, and 20 to 100° C., E′C40, is 3.0 or more and 15.0 or less, and a loss factor tan δ in the dynamic viscoelasticity measurement performed under the bending mode condition is 0.10 or more and 0.30 or less in a range of 40° C. or more and 70° C. or less.

公开(公告)号：US20230364736A1

公开(公告)日：2023-11-16

申请号：US18246608

申请日：2021-09-29

申请人： FUJIBO HOLDINGS, INC.

发明人： Yoshihide KAWAMURA ,  Teppei TATENO ,  Ryuma MATSUOKA ,  Hiroshi KURIHARA ,  Satsuki NARUSHIMA ,  Yamato TAKAMIZAWA ,  Keisuke OCHI ,  Tetsuaki KAWASAKI

IPC分类号： B24B37/24 ,  B24B37/22

CPC分类号： B24B37/24 ,  B24B37/22

摘要： A polishing pad contains: a polishing layer having a polishing surface for polishing a workpiece; and a cushion layer disposed on the side of the polishing layer opposite from the polishing surface. With regard to the ratio (tanδ) of the storage elastic modulus E′ to the loss elastic modulus E″ of the whole polishing pad, as obtained through dynamic viscoelasticity measurement using frequency dispersion (25° C.) in a bending mode, the ratio of the maximum value of tanδ measured at 100-1000 rad/s (tanδmax100-100) to the maximum value of tanδ measured at 1 to 10 rad/s (tanδmax1-10) is 0.75 to 1.30.

公开(公告)号：US20240139903A1

公开(公告)日：2024-05-02

申请号：US18278838

申请日：2022-03-23

申请人： FUJIBO HOLDINGS, INC.

发明人： Teppei TATENO ,  Hiroshi KURIHARA ,  Satsuki YAMAGUCHI ,  Yamato TAKAMIZAWA

IPC分类号： B24B37/24 ,  B24D3/00

CPC分类号： B24B37/24 ,  B24D3/00

摘要： A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer, a cross-section of the polishing layer has an average pore diameter of 10-14 μm, and in a histogram of pore diameters in a cross-section of the polishing layer where the bin width is 1 μm, the sum of pores that are 25 μm or greater is 5% or less with respect to the total number of pores in the cross-section, and the sum of the areas of the pores in each bin that is 25 μm or greater is 20% or less with respect to the total area of the pores in the cross-section.

公开(公告)号：US20200230780A1

公开(公告)日：2020-07-23

申请号：US16650597

申请日：2018-10-12

申请人： Fujibo Holdings, Inc.

发明人： Hirohito MIYASAKA ,  Teppei TATENO ,  Ryuma MATSUOKA ,  Hiroshi KURIHARA ,  Takumi MIKUNI

IPC分类号： B24B37/24 ,  H01L21/304 ,  B24B37/26 ,  B24D3/28

摘要： A polishing pad includes: a polishing layer having a polyurethane sheet containing substantially spherical cells, wherein E′(90%)/E′(30%) falls within a range of 0.4 to 0.7, where E′(90%) represents a storage modulus of the polyurethane sheet that has been exposed to an environment with a temperature of 23° C. and a relative humidity of 90%, as measured in a tension mode at 40° C. with an initial load of 148 g, a strain range of 0.1%, and a measurement frequency of 1.6 Hz, and E′(30%) represents a storage modulus of the polyurethane sheet that has been exposed to an environment with a temperature of 23° C. and a relative humidity of 30%, as measured in a tension mode at 40° C. with an initial load of 148 g, a strain range of 0.1%, and a measurement frequency of 1.6 Hz. Also provided is a method for manufacturing the polishing pad.

公开(公告)号：US20180311782A1

公开(公告)日：2018-11-01

申请号：US15770435

申请日：2016-10-25

申请人： FUJIBO HOLDINGS, INC.

发明人： Shin TOKUSHIGE ,  Keisuke NAKASE ,  Hiroshi KURIHARA ,  Hiroshi KASHIWADA ,  Kenichi KOIKE

IPC分类号： B24B37/24 ,  B24D3/28 ,  B24D3/00 ,  B24D18/00

CPC分类号： B24B37/24 ,  H01L21/304

摘要： A lapping material having a knitted fabric constituted by warp knitting or weft knitting, and a resin with which the knitted fabric is impregnated.