Resin lapping plate and lapping method using the same
    3.
    发明授权
    Resin lapping plate and lapping method using the same 有权
    树脂研磨板和研磨方法使用相同

    公开(公告)号:US09370853B2

    公开(公告)日:2016-06-21

    申请号:US14570789

    申请日:2014-12-15

    摘要: The present invention provides a lapping plate, which provides a high lapping rate and also can suppress the generation of scratches on a surface of a polishing workpiece. The present invention provides a resin lapping plate comprising a resin sheet comprising a thermosetting polyurethane resin and having an opening rate of 10 to 50% and a Young's modulus of 7.0×107 to 5.0×108 N/m2.

    摘要翻译: 本发明提供一种研磨板,其提供高的研磨速度,并且还可以抑制在抛光工件的表面上产生划痕。 本发明提供一种树脂研磨板,其包含热固性聚氨酯树脂的树脂片,其开口率为10〜50%,杨氏模量为7.0×10 7×10 8×10 N / m 2。

    Polishing pad and method for manufacturing same

    公开(公告)号:US11883925B2

    公开(公告)日:2024-01-30

    申请号:US17040638

    申请日:2019-03-19

    IPC分类号: B24B37/24

    CPC分类号: B24B37/24

    摘要: A polishing pad is equipped with a polishing layer having a polyurethane sheet, wherein a tan δ peak value change rate determined by formula: tan δ peak value change rate=|tan δ peakwet−tan δ peakdry|/tan δ peakdry×100, is not more than 15%, where tan δ peakwet represents the peak value of the loss tangent tan δ, of the polyurethane sheet in a wet state after being immersed in water for three days, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz, and tan δ peakdry represents the peak value of the loss tangent tan δ, of the polyurethane sheet in a dry state without being immersed in water, within a temperature range of 20-100° C. in a tensile mode under an initial load of 148 g with a strain range of 0.1% at a measurement frequency of 1.6 Hz.