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公开(公告)号:US20240149390A1
公开(公告)日:2024-05-09
申请号:US18278405
申请日:2022-03-18
发明人: Yoshihide KAWAMURA , Teppei TATENO , Hiroshi KURIHARA , Satsuki YAMAGUCHI , Yamato TAKAMIZAWA , Keisuke OCHI , Tetsuaki KAWASAKI
IPC分类号: B24B37/22
CPC分类号: B24B37/22
摘要: Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous phase content in the polishing layer measured at 80° C. by a pulsed NMR method to a weight proportion (NC40) of the amorphous phase content in the polishing layer measured at 40° C. by the pulsed NMR method is between 1.5 and 2.5.
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公开(公告)号:US20240149389A1
公开(公告)日:2024-05-09
申请号:US18282165
申请日:2021-03-22
CPC分类号: B24B37/042 , C08J5/18 , C08J9/0061 , C08J9/18 , C08J2203/22 , C08J2375/08 , C08J2433/20 , H01L21/30625
摘要: A polishing pad including a polyurethane sheet as a polishing layer, wherein the polyurethane sheet has a ratio (E′B40/E′T40) of a storage elastic modulus E′B40 at 40° C. in dynamic viscoelasticity measurement performed under a bending mode condition with a frequency of 1.6 Hz to a storage elastic modulus E′T40 at 40° C. in dynamic viscoelasticity measurement performed under a tension mode condition with a frequency of 1.6 Hz of 0.60 to 1.60.
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公开(公告)号:US20240139903A1
公开(公告)日:2024-05-02
申请号:US18278838
申请日:2022-03-23
摘要: A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer, a cross-section of the polishing layer has an average pore diameter of 10-14 μm, and in a histogram of pore diameters in a cross-section of the polishing layer where the bin width is 1 μm, the sum of pores that are 25 μm or greater is 5% or less with respect to the total number of pores in the cross-section, and the sum of the areas of the pores in each bin that is 25 μm or greater is 20% or less with respect to the total area of the pores in the cross-section.
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公开(公告)号:US20240227118A9
公开(公告)日:2024-07-11
申请号:US18278402
申请日:2022-03-29
发明人: Teppei TATENO , Hiroshi KURIHARA , Satsuki YAMAGUCHI , Yamato TAKAMIZAWA , Keisuke OCHI , Tetsuaki KAWASAKI
IPC分类号: B24B37/22
CPC分类号: B24B37/22
摘要: This polishing pad has a polishing layer that comprises a polyurethane resin foam derived from an isocyanate-terminated prepolymer and a curing agent, wherein: the distance between hard segments in the polishing layer as measured by small-angle X-ray scattering is 9.5 nm or less; or the ratio (NC80/CC80) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 80° C. to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 80° C. is 2.6-3.1, and the ratio (NC40/CC40) of the content proportion by weight (NC40) of an amorphous phase in the polishing layer as measured by pulse NMR at 40° C. to the content proportion by weight (CC40) of a crystalline phase in the polishing layer as measured by pulse NMR at 40° C. is 0.5-0.9.
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公开(公告)号:US20240131653A1
公开(公告)日:2024-04-25
申请号:US18278402
申请日:2022-03-28
发明人: Teppei TATENO , Hiroshi KURIHARA , Satsuki YAMAGUCHI , Yamato TAKAMIZAWA , Keisuke OCHI , Tetsuaki KAWASAKI
IPC分类号: B24B37/22
CPC分类号: B24B37/22
摘要: This polishing pad has a polishing layer that comprises a polyurethane resin foam derived from an isocyanate-terminated prepolymer and a curing agent, wherein: the distance between hard segments in the polishing layer as measured by small-angle X-ray scattering is 9.5 nm or less; or the ratio (NC80/CC80) of the content proportion by weight (NC80) of an amorphous phase in the polishing layer as measured by pulse NMR at 80° C. to the content proportion by weight (CC80) of a crystalline phase in the polishing layer as measured by pulse NMR at 80° C. is 2.6-3.1, and the ratio (NC40/CC40) of the content proportion by weight (NC40) of an amorphous phase in the polishing layer as measured by pulse NMR at 40° C. to the content proportion by weight (CC40) of a crystalline phase in the polishing layer as measured by pulse NMR at 40° C. is 0.5-0.9.
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