Invention Publication
- Patent Title: FILM ADHESIVE, ELECTRONIC COMPONENT USING THE SAME, AND METHOD OF PRODUCING THE SAME
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Application No.: US18537276Application Date: 2023-12-12
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Publication No.: US20240141216A1Publication Date: 2024-05-02
- Inventor: Koyuki SAKAI , Minoru MORITA
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP 21135624 2021.08.23
- Main IPC: C09J163/00
- IPC: C09J163/00 ; H01L27/146
Abstract:
A film adhesive containing: an epoxy resin (A); an epoxy resin curing agent (B); and a phenoxy resin (C),
wherein a content of the epoxy resin curing agent (B) in the film adhesive is 0.30 to 12.0 mass %; and
wherein a light transmittance T1 of the film adhesive at a wavelength of 400 nm is 90% or less, a light transmittance T2 of a cured product obtained by thermally curing the film adhesive at a wavelength of 400 nm is 85% or more, and T1
wherein a content of the epoxy resin curing agent (B) in the film adhesive is 0.30 to 12.0 mass %; and
wherein a light transmittance T1 of the film adhesive at a wavelength of 400 nm is 90% or less, a light transmittance T2 of a cured product obtained by thermally curing the film adhesive at a wavelength of 400 nm is 85% or more, and T1
Information query
