公开(公告)号：US20240141216A1

公开(公告)日：2024-05-02

申请号：US18537276

申请日：2023-12-12

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Koyuki SAKAI ,  Minoru MORITA

IPC: C09J163/00 ,  H01L27/146

CPC classification number: C09J163/00 ,  H01L27/14632 ,  H01L27/14687

Abstract: A film adhesive containing: an epoxy resin (A); an epoxy resin curing agent (B); and a phenoxy resin (C),
wherein a content of the epoxy resin curing agent (B) in the film adhesive is 0.30 to 12.0 mass %; and
wherein a light transmittance T1 of the film adhesive at a wavelength of 400 nm is 90% or less, a light transmittance T2 of a cured product obtained by thermally curing the film adhesive at a wavelength of 400 nm is 85% or more, and T1

公开(公告)号：US20230295470A1

公开(公告)日：2023-09-21

申请号：US18203389

申请日：2023-05-30

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Koyuki SAKAI ,  Kenji TOKUHISA

IPC: C09J7/29 ,  C09J7/25

CPC classification number: C09J7/29 ,  C09J7/25

Abstract: A base material/adhesive layer integrated sheet for a flexible device, containing a flexible film and an adhesive layer, in which the flexible film and the adhesive layer are laminated, an absolute value of a difference between surface free energy of the flexible film and surface free energy of a cured layer obtained by curing the adhesive layer is 30 dyn/cm or less, and the cured layer has a storage modulus of 5.0 GPa or less; and



a method of producing a flexible device with the same.

公开(公告)号：US20230295417A1

公开(公告)日：2023-09-21

申请号：US18203414

申请日：2023-05-30

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Koyuki SAKAI

IPC: C08L63/00 ,  C09J163/00 ,  C08K5/5435 ,  C09J7/38 ,  C09J11/06

CPC classification number: C08L63/00 ,  C09J163/00 ,  C08K5/5435 ,  C09J7/38 ,  C09J11/06 ,  C08L2203/20 ,  C08L2203/16 ,  C09J2463/00 ,  C09J2301/302

Abstract: A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modulus of 5.0 GPa or less,



a film-like adhesive using the resin composition,
an adhesive sheet having a laminated structure of the film-like adhesive and
a flexible base material, and a method of producing a flexible device.

公开(公告)号：US20220186095A1

公开(公告)日：2022-06-16

申请号：US17686190

申请日：2022-03-03

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA ,  Koyuki SAKAI ,  Keita WATAHIKI

IPC: C09J163/00

Abstract: A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.