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公开(公告)号:US20240141216A1
公开(公告)日:2024-05-02
申请号:US18537276
申请日:2023-12-12
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor: Koyuki SAKAI , Minoru MORITA
IPC: C09J163/00 , H01L27/146
CPC classification number: C09J163/00 , H01L27/14632 , H01L27/14687
Abstract: A film adhesive containing: an epoxy resin (A); an epoxy resin curing agent (B); and a phenoxy resin (C),
wherein a content of the epoxy resin curing agent (B) in the film adhesive is 0.30 to 12.0 mass %; and
wherein a light transmittance T1 of the film adhesive at a wavelength of 400 nm is 90% or less, a light transmittance T2 of a cured product obtained by thermally curing the film adhesive at a wavelength of 400 nm is 85% or more, and T1-
2.
公开(公告)号:US20230295470A1
公开(公告)日:2023-09-21
申请号:US18203389
申请日:2023-05-30
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor: Koyuki SAKAI , Kenji TOKUHISA
Abstract: A base material/adhesive layer integrated sheet for a flexible device, containing a flexible film and an adhesive layer, in which the flexible film and the adhesive layer are laminated, an absolute value of a difference between surface free energy of the flexible film and surface free energy of a cured layer obtained by curing the adhesive layer is 30 dyn/cm or less, and the cured layer has a storage modulus of 5.0 GPa or less; and
a method of producing a flexible device with the same.-
公开(公告)号:US20230295417A1
公开(公告)日:2023-09-21
申请号:US18203414
申请日:2023-05-30
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor: Koyuki SAKAI
IPC: C08L63/00 , C09J163/00 , C08K5/5435 , C09J7/38 , C09J11/06
CPC classification number: C08L63/00 , C09J163/00 , C08K5/5435 , C09J7/38 , C09J11/06 , C08L2203/20 , C08L2203/16 , C09J2463/00 , C09J2301/302
Abstract: A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modulus of 5.0 GPa or less,
a film-like adhesive using the resin composition,
an adhesive sheet having a laminated structure of the film-like adhesive and
a flexible base material, and a method of producing a flexible device.-
公开(公告)号:US20220186095A1
公开(公告)日:2022-06-16
申请号:US17686190
申请日:2022-03-03
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor: Minoru MORITA , Koyuki SAKAI , Keita WATAHIKI
IPC: C09J163/00
Abstract: A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 μm or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.
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