公开(公告)号：US20220367234A1

公开(公告)日：2022-11-17

申请号：US17872568

申请日：2022-07-25

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yota OTANI ,  Hiromitsu MARUYAMA ,  Minoru MORITA

IPC: H01L21/683 ,  H01L23/00

Abstract: A dicing die attach film including a dicing film and a die attach film laminated on the dicing film, in which the die attach film has an arithmetic average roughness Ra1 of from 0.05 to 2.50 μm at a surface in contact with the dicing film, and a value of ratio of Ra1 to an arithmetic average roughness Ra2 at a surface that is of the die attach film and is opposite to the surface in contact with the dicing film is from 1.05 to 28.00.

公开(公告)号：US20240352289A1

公开(公告)日：2024-10-24

申请号：US18756411

申请日：2024-06-27

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA ,  Shunya OHBUCHI

IPC: C09J163/00 ,  C09J5/06 ,  C09J11/04 ,  C09J11/06 ,  H01L21/683

CPC classification number: C09J163/00 ,  C09J5/06 ,  C09J11/04 ,  C09J11/06 ,  H01L21/6836

Abstract: A thermally conductive film adhesive composition including an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C), a polyhedral alumina filler (D), and a silane coupling agent (E), wherein a percentage of the polyhedral alumina filler (D) to a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C), the polyhedral alumina filler (D), and the silane coupling agent (E) is from 20 to 70 vol %, and wherein a blending multiple of the silane coupling agent is from 1.0 to 10;



a film adhesive using the composition;
a semiconductor package; and
a producing method thereof.

公开(公告)号：US20200308354A1

公开(公告)日：2020-10-01

申请号：US16902817

申请日：2020-06-16

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA

IPC: C08J5/18 ,  C08L63/00 ,  C08K3/04

Abstract: Provided is a method for producing an anisotropic conductive sheet that can be used for an inspection of a semiconductor package or a high-frequency component part, in which the pitch of wiring is narrowed and the wiring itself has been subjected to wire thinning, and that can be easily produced.Disclosed is a method for producing an anisotropic conductive sheet, the method including a molding step of molding a conductive filler material-containing composition including (A) a conductive filler material dispersed in an organic solvent and (B) a binder resin, into a sheet-like body, and an organic solvent volatilization step of heating one surface of the sheet-like body and thereby volatilizing the organic solvent through the other surface of the sheet-like body.

公开(公告)号：US20240141216A1

公开(公告)日：2024-05-02

申请号：US18537276

申请日：2023-12-12

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Koyuki SAKAI ,  Minoru MORITA

IPC: C09J163/00 ,  H01L27/146

CPC classification number: C09J163/00 ,  H01L27/14632 ,  H01L27/14687

Abstract: A film adhesive containing: an epoxy resin (A); an epoxy resin curing agent (B); and a phenoxy resin (C),
wherein a content of the epoxy resin curing agent (B) in the film adhesive is 0.30 to 12.0 mass %; and
wherein a light transmittance T1 of the film adhesive at a wavelength of 400 nm is 90% or less, a light transmittance T2 of a cured product obtained by thermally curing the film adhesive at a wavelength of 400 nm is 85% or more, and T1

公开(公告)号：US20220077101A1

公开(公告)日：2022-03-10

申请号：US17529388

申请日：2021-11-18

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA

IPC: H01L23/00 ,  H01L25/065 ,  C09J163/00

Abstract: A dicing die attach film, including an adhesive layer and a temporary-adhesive layer, the adhesive layer and the temporary-adhesive layer being laminated, wherein the adhesive layer is a film-like adhesive layer containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D); an elastic modulus of the phenoxy resin (C) at 25° C. is 500 MPa or more; in the adhesive layer, a proportion of the phenoxy resin (C) in total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60% by mass; a peeling strength between the adhesive layer and the temporary-adhesive layer at a range of 25 to 80° C. is 0.40 N/25 mm or less; and a thermal conductivity of the adhesive layer after thermal curing is 1.0 W/m·K or more.

公开(公告)号：US20210292617A1

公开(公告)日：2021-09-23

申请号：US17338147

申请日：2021-06-03

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA

IPC: C09J163/00 ,  C09J7/35 ,  C09J11/08 ,  C09J11/04 ,  H01L25/065 ,  H01L23/00 ,  H01L21/683 ,  H01L21/78

Abstract: An adhesive composition, containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C) and an inorganic filler (D), in which the inorganic filler (D) satisfies the condition (1) of (an average particle diameter (d50) is 0.1 to 3.5 μm) and condition (2) of (a ratio of a particle diameter at 90% cumulative distribution frequency (d90) to the average particle diameter (d50) is 5.0 or less), and a proportion of the inorganic filler (D) in a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C) and the inorganic filler (D) is 20 to 70% by volume; a film-like adhesive and a production method thereof; and a semiconductor package and a production method thereof.

公开(公告)号：US20240150622A1

公开(公告)日：2024-05-09

申请号：US18543182

申请日：2023-12-18

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA

IPC: C09J7/35 ,  C09J7/10 ,  H01L21/683 ,  H01L21/78

CPC classification number: C09J7/35 ,  C09J7/10 ,  H01L21/6836 ,  H01L21/78 ,  C09J2203/326 ,  C09J2301/304 ,  C09J2463/00 ,  C09J2475/00

Abstract: An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a polyurethane resin (C), and an inorganic filler (D), wherein the polyurethane resin (C) has a tan δ peak top temperature of 0° C. or higher in dynamic mechanical analysis, and the proportion of the polyurethane resin (C) based on the total content of the epoxy resin (A) and the polyurethane resin (C) is from 2 to 50 mass %.

公开(公告)号：US20240128154A1

公开(公告)日：2024-04-18

申请号：US18531002

申请日：2023-12-06

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/3735 ,  H01L23/3731 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/05005 ,  H01L2224/05022 ,  H01L2224/45005 ,  H01L2224/4502 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/04894 ,  H01L2924/0665 ,  H01L2924/351

Abstract: Provided is a thermally conductive film-like adhesive capable of sufficiently advancing a curing reaction under milder conditions, capable of effectively suppressing residual voids between the adhesive and a wiring board in a semiconductor package to be obtained when used as a die attach film, and capable of obtaining a semiconductor package excellent in heat releasing property inside the package. In addition, provided are a semiconductor package using the thermally conductive film-like adhesive and a method of producing the same.

公开(公告)号：US20240084172A1

公开(公告)日：2024-03-14

申请号：US18388278

申请日：2023-11-09

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA ,  Tomohito KAJIHARA ,  Yota OTANI ,  Hiromitsu MARUYAMA

IPC: C09J7/10 ,  C09J7/35 ,  C09J7/40 ,  H01L21/78 ,  H01L23/00 ,  H01L25/065

CPC classification number: C09J7/10 ,  C09J7/35 ,  C09J7/405 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  C08K3/36 ,  C09J2400/16 ,  C09J2463/00 ,  C09J2475/00

Abstract: Disclosed are: an adhesive composition including an epoxy resin (A), an epoxy resin curing agent (B), a polyurethane resin (C), and an inorganic filler (D), in which the polyurethane resin (C) has a storage elastic modulus at 25° C., in a dynamic viscoelastic analysis, of 8.0 MPa or higher, a proportion of the polyurethane resin (C) based on a total content of the epoxy resin (A) and the polyurethane resin (C) is from 2.0 to 50.0 mass %, and a maximum tensile stress in a stress-strain curve when a tensile strength is applied to a film adhesive formed using the adhesive composition is 7.0 MPa or higher; a film adhesive using the adhesive composition; a semiconductor package; and a producing method thereof.

公开(公告)号：US20220310547A1

公开(公告)日：2022-09-29

申请号：US17826793

申请日：2022-05-27

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Minoru MORITA ,  Yota OTANI ,  Hiromitsu MARUYAMA

IPC: H01L23/00 ,  H01L25/065

Abstract: A dicing die attach film containing a dicing film and a die attach film stacked on the dicing film, wherein the die attach film contains an organic solvent having a boiling point of 100° C. or more and less than 150° C. and a vapor pressure of 50 mmHg or less, and wherein an amount of the organic solvent in the die attach film satisfies the following (a):
(a) when 1.0 g of the die attach film is immersed in 10.0 mL of acetone at 4° C. for 24 hours, an amount of the organic solvent extracted into the acetone is 800 μg or less.