Invention Publication
- Patent Title: SUBSTRATE PROCESSING APPARATUS
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Application No.: US18187098Application Date: 2023-03-21
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Publication No.: US20240149289A1Publication Date: 2024-05-09
- Inventor: Bu Young JUNG , Ju Hwan LEE , Hyun Woo BAE
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Priority: KR 20220147522 2022.11.08
- Main IPC: B05B13/02
- IPC: B05B13/02 ; B05B14/10 ; B05B14/30 ; B05C9/06

Abstract:
A substrate processing apparatus includes a first supply pipe supplying a first chemical liquid to a substrate, a second supply pipe, spaced apart from the first supply pipe, and supplying a second chemical liquid to the substrate, and a recovery pipe connected to the first supply pipe to collect the first chemical liquid, and disposed between the first supply pipe and the second supply pipe.
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