公开(公告)号：US20250025923A1

公开(公告)日：2025-01-23

申请号：US18907549

申请日：2024-10-06

Applicant: SEMES CO., LTD.

Inventor： Ju Hwan LEE ,  Hyeon Jun LEE ,  So Young PARK ,  Myung A JEON

IPC: B08B3/02 ,  B08B13/00 ,  H01L21/67

Abstract: Proposed are a substrate processing apparatus having improved substrate drying performance by separately providing a chemical liquid supply nozzle and a gas supply nozzle; and a substrate processing method.

公开(公告)号：US20240091819A1

公开(公告)日：2024-03-21

申请号：US18117592

申请日：2023-03-06

Applicant: SEMES CO., LTD.

Inventor： Ju Hwan LEE ,  Hyeon Jun LEE ,  So Young PARK ,  Myung A JEON

IPC: B08B3/02 ,  B08B13/00

CPC classification number: B08B3/022 ,  B08B13/00 ,  H01L21/67051

Abstract: Proposed are a substrate processing apparatus having improved substrate drying performance by separately providing a chemical liquid supply nozzle and a gas supply nozzle; and a substrate processing method.

公开(公告)号：US20240149289A1

公开(公告)日：2024-05-09

申请号：US18187098

申请日：2023-03-21

Applicant: SEMES CO., LTD.

Inventor： Bu Young JUNG ,  Ju Hwan LEE ,  Hyun Woo BAE

IPC: B05B13/02 ,  B05B14/10 ,  B05B14/30 ,  B05C9/06

CPC classification number: B05B13/0278 ,  B05B14/10 ,  B05B14/30 ,  B05C9/06 ,  B05D1/34

Abstract: A substrate processing apparatus includes a first supply pipe supplying a first chemical liquid to a substrate, a second supply pipe, spaced apart from the first supply pipe, and supplying a second chemical liquid to the substrate, and a recovery pipe connected to the first supply pipe to collect the first chemical liquid, and disposed between the first supply pipe and the second supply pipe.

公开(公告)号：US20220392784A1

公开(公告)日：2022-12-08

申请号：US17829678

申请日：2022-06-01

Applicant: SEMES CO., LTD.

Inventor： Ji Ho KIM ,  Jong Han KIM ,  Ju Dong LEE ,  Ju Hwan LEE ,  Hyeon Jun LEE

IPC: H01L21/67 ,  H01L21/02

Abstract: The inventive concept provides a liquid treating apparatus. The liquid treating apparatus includes a spin chuck configured to support and rotate a substrate; and a liquid supply unit configured to supply a liquid to the substrate, and wherein the liquid supply unit includes: a first nozzle connected to a first flow path pipe and configured to discharge a first liquid to the substrate; a first valve assembly including a first cut-off valve for cutting-off a flow of the first liquid within the first flow path pipe and a first suck-back valve for sucking-back the first liquid, and installed at the first flow pipe; a second nozzle connected to a second flow path pipe and configured to discharge a second liquid to the substrate; a second valve assembly including a second cut-off valve for cutting-off a flow of the second liquid within the second flow path pipe and a second suck-back valve for sucking-back the second liquid, and installed at the second flow pipe path; a first flow velocity controller configured to adjust an air flow velocity of an air introduced into or outflowed from the first suck-back valve; and a second flow velocity controller configured to adjust an air flow velocity of an air introduced into or outflowed from the second suck-back valve, and wherein a first speed of a suck-back speed provided by the first valve assembly is slower than a second suck-back speed provided by the second valve assembly, and a surface tension of the first liquid is lower than a surface tension of the second liquid.