Invention Publication
- Patent Title: Temperature Control in Chemical Mechanical Polish
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Application No.: US18410408Application Date: 2024-01-11
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Publication No.: US20240149388A1Publication Date: 2024-05-09
- Inventor: Kei-Wei Chen , Chih Hung Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: B24B37/015
- IPC: B24B37/015 ; B24B37/20 ; B24B37/30 ; B24B53/017
Abstract:
A method includes polishing a wafer on a polishing pad, performing conditioning on the polishing pad using a disk of a pad conditioner, and conducting a heat-exchange media into the disk. The heat-exchange media conducted into the disk has a temperature different from a temperature of the polishing pad.
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