Invention Publication
- Patent Title: METHODS OF FABRICATING OLED PANEL WITH INORGANIC PIXEL ENCAPSULATING BARRIER
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Application No.: US18545676Application Date: 2023-12-19
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Publication No.: US20240164149A1Publication Date: 2024-05-16
- Inventor: Ji Young CHOUNG , Dieter HAAS , Yu-hsin LIN , Jungmin LEE , Seong Ho YOO , Si Kyoung KIM
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H10K59/122
- IPC: H10K59/122 ; H10K50/84 ; H10K50/844 ; H10K71/00

Abstract:
Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.
Public/Granted literature
- US12295215B2 Methods of fabricating OLED panel with inorganic pixel encapsulating barrier Public/Granted day:2025-05-06
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