公开(公告)号：US20230284484A1

公开(公告)日：2023-09-07

申请号：US18314915

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20240019606A1

公开(公告)日：2024-01-18

申请号：US17864193

申请日：2022-07-13

Applicant: Applied Materials, Inc.

Inventor： Helinda NOMINANDA ,  Tae Kyung WON ,  Han NGUYEN ,  Seong Ho YOO ,  Soo Young CHOI

IPC: G02B1/14 ,  G02B1/11 ,  C23C16/02 ,  C23C14/02 ,  C23C14/06

CPC classification number: G02B1/14 ,  G02B1/11 ,  C23C16/0272 ,  C23C14/024 ,  C23C14/06

Abstract: Implementations of the present disclosure relate to methods, and related apparatus and devices, of forming flexible cover lens structures for flexible or foldable display devices. In one or more implementations, one or more adhesion promotion layers are deposited above at least one wet hardcoat layer of a substrate structure. A dry hardcoat layer is deposited above the one or more adhesion promotion layers using a dry deposition process that includes plasma enhanced chemical vapor deposition (PECVD). An anti-smudge layer is deposited above the dry hardcoat layer. Each of the one or more adhesion promotion layers, the dry hardcoat layer, and the anti-smudge layer is deposited at a process temperature that is less than 80 degrees Celsius.

公开(公告)号：US20230076050A1

公开(公告)日：2023-03-09

申请号：US18049825

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20230345771A1

公开(公告)日：2023-10-26

申请号：US18346059

申请日：2023-06-30

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu Hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20230061457A1

公开(公告)日：2023-03-02

申请号：US18049868

申请日：2022-10-26

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20220077252A1

公开(公告)日：2022-03-10

申请号：US17193347

申请日：2021-03-05

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu Hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20240164149A1

公开(公告)日：2024-05-16

申请号：US18545676

申请日：2023-12-19

Applicant: Applied Materials, Inc.

Inventor： Ji Young CHOUNG ,  Dieter HAAS ,  Yu-hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00

CPC classification number: H10K59/122 ,  H10K50/84 ,  H10K50/844 ,  H10K71/00 ,  H10K59/1201

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

公开(公告)号：US20230269969A1

公开(公告)日：2023-08-24

申请号：US18040161

申请日：2021-07-27

Applicant: Applied Materials, Inc.

Inventor： Jungmin LEE ,  Seong Ho YOO ,  Dieter HAAS ,  Si Kyoung KIM ,  Yu-hsin LIN ,  Ji Young CHOUNG

IPC: H10K59/122 ,  H10K59/80 ,  H10K59/12

CPC classification number: H10K59/122 ,  H10K59/873 ,  H10K59/1201

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The adjacent metal-containing overhang structures defining each sub-pixel of the sub-pixel circuit of the display provide for formation of the sub-pixel circuit using evaporation deposition and provide for the metal-containing overhang structures to remain in place after the sub-pixel circuit is formed (e.g., utilizing the methods of the fifth, sixth, or seventh exemplary embodiments). Evaporation deposition may be utilized for deposition of an OLED material and cathode. The metal-containing overhang structures define deposition angles, i.e., provide for a shadowing effect during evaporation deposition. The encapsulation layer of a respective sub-pixel is disposed over the cathode with the encapsulation layer extending under at least a portion of each of the adjacent metal-containing overhang structures and along a sidewall of each of the adjacent metal-containing overhang structures.

公开(公告)号：US20220077251A1

公开(公告)日：2022-03-10

申请号：US17193321

申请日：2021-03-05

Applicant: Applied Materials, Inc.

Inventor： Ji-young CHOUNG ,  Dieter HAAS ,  Yu Hsin LIN ,  Jungmin LEE ,  Seong Ho YOO ,  Si Kyoung KIM

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a substrate, adjacent pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, inorganic overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material disposed over and in contact with the anode, a cathode disposed over the OLED material and extending under the inorganic overhang structures adjacent to each sub-pixel, and an encapsulation layer disposed over the cathode. The encapsulation layer extends under at least a portion of the inorganic overhang structures and along a sidewall of the inorganic overhang structures.