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    ADVANCED PATTERNING OLED OVERHANG SUB-PIXEL CIRCUIT AND PATTERNING METHOD
    1.
    发明申请
    ADVANCED PATTERNING OLED OVERHANG SUB-PIXEL CIRCUIT AND PATTERNING METHOD 有权

    公开(公告)号：US20250048844A1

    公开(公告)日：2025-02-06

    申请号：US18771267

    申请日：2024-07-12

    Applicant: Applied Materials, Inc.

    Inventor： Jungmin LEE ,  Dieter HAAS ,  Yu-Hsin LIN ,  Chung-chia CHEN ,  Ji Young CHOUNG

    IPC: H10K59/122 ,  H10K59/12

    Abstract: Embodiments described herein relate to a method of forming a sub-pixel. The method includes depositing a first structure material over a substrate and an anode. The anode is disposed over the substrate. An interlayer dielectric (ILD) material is deposited over the first structure material. An ILD material is patterned. An intermediate structure material is deposited over the ILD material and the first structure material. A second structure material is deposited over the intermediate structure material. A portion of the second structure material is removed to form a second structure. A portion of the intermediate structure material disposed over the ILD material is removed to form an intermediate structure. A portion of the first structure material is removed to form a first structure of an overhang structure. The overhang structure comprises the first structure, the second structure, and the intermediate structure.

    DESCENDING ETCHING RESISTANCE IN ADVANCED SUBSTRATE PATTERNING
    3.
    发明公开
    DESCENDING ETCHING RESISTANCE IN ADVANCED SUBSTRATE PATTERNING 审中-公开

    公开(公告)号：US20230263012A1

    公开(公告)日：2023-08-17

    申请号：US18139243

    申请日：2023-04-25

    Applicant: Applied Materials, Inc.

    Inventor： Chung-Chia CHEN ,  Ji Young CHOUNG ,  Dieter HAAS ,  Yu-Hsin LIN ,  Jungmin LEE ,  Wen-Hao WU ,  Si Kyoung KIM

    IPC: H10K59/122 ,  H10K59/173 ,  H10K59/80

    CPC classification number: H10K59/122 ,  H10K59/173 ,  H10K59/873

    Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

    METAL OVERHANG FOR ADVANCED PATTERNING
    10.
    发明公开
    METAL OVERHANG FOR ADVANCED PATTERNING 审中-公开

    公开(公告)号：US20230269969A1

    公开(公告)日：2023-08-24

    申请号：US18040161

    申请日：2021-07-27

    Applicant: Applied Materials, Inc.

    Inventor： Jungmin LEE ,  Seong Ho YOO ,  Dieter HAAS ,  Si Kyoung KIM ,  Yu-hsin LIN ,  Ji Young CHOUNG

    IPC: H10K59/122 ,  H10K59/80 ,  H10K59/12

    CPC classification number: H10K59/122 ,  H10K59/873 ,  H10K59/1201

    Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The adjacent metal-containing overhang structures defining each sub-pixel of the sub-pixel circuit of the display provide for formation of the sub-pixel circuit using evaporation deposition and provide for the metal-containing overhang structures to remain in place after the sub-pixel circuit is formed (e.g., utilizing the methods of the fifth, sixth, or seventh exemplary embodiments). Evaporation deposition may be utilized for deposition of an OLED material and cathode. The metal-containing overhang structures define deposition angles, i.e., provide for a shadowing effect during evaporation deposition. The encapsulation layer of a respective sub-pixel is disposed over the cathode with the encapsulation layer extending under at least a portion of each of the adjacent metal-containing overhang structures and along a sidewall of each of the adjacent metal-containing overhang structures.

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