Invention Publication
- Patent Title: RESIN COMPOSITION
-
Application No.: US18300383Application Date: 2023-04-13
-
Publication No.: US20240166874A1Publication Date: 2024-05-23
- Inventor: Te-Chao Liao , Yu-Ting Liu , Hung-Yi Chang , Chia-Lin Liu , Wei-Ru Huang
- Applicant: NAN YA PLASTICS CORPORATION
- Applicant Address: TW TAIPEI
- Assignee: NAN YA PLASTICS CORPORATION
- Current Assignee: NAN YA PLASTICS CORPORATION
- Current Assignee Address: TW TAIPEI
- Priority: TW 1141999 2022.11.03 TW 2103321 2023.01.31
- Main IPC: C08L79/08
- IPC: C08L79/08 ; C08K3/36 ; C08K5/5415
Abstract:
A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
Information query
