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公开(公告)号:US20240174849A1
公开(公告)日:2024-05-30
申请号:US18071629
申请日:2022-11-30
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
CPC classification number: C08L47/00 , C08J5/244 , C08J2347/00 , C08J2471/12
Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.
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公开(公告)号:US20240174779A1
公开(公告)日:2024-05-30
申请号:US18149155
申请日:2023-01-03
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu , HungFan Lee
IPC: C08F212/08 , C08F210/02 , C08F212/36 , C08F236/06 , C08G65/48 , C08K3/36 , C08K5/49 , C08K5/5425 , C08K9/08
CPC classification number: C08F212/08 , C08F210/02 , C08F212/36 , C08F236/06 , C08G65/485 , C08K3/36 , C08K5/49 , C08K5/5425 , C08K9/08 , C08G2650/04 , C08K2201/003
Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, a spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene, a second resin including a polyphenylene ether resin modified by bismaleimide, and a SBS resin. The resin composition of the present disclosure can have a high glass transition temperature, a low dielectric constant and a low dissipation factor.
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公开(公告)号:US20240158632A1
公开(公告)日:2024-05-16
申请号:US18074526
申请日:2022-12-05
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
IPC: C08L71/12
CPC classification number: C08L71/123 , C08L2205/03
Abstract: A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.
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公开(公告)号:US20250002621A1
公开(公告)日:2025-01-02
申请号:US18448962
申请日:2023-08-13
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
IPC: C08F212/08 , C08F210/02 , C08F212/36 , C08G65/48 , C08K3/36 , C08K5/01 , C08K5/3415 , C08L53/02
Abstract: A resin composition includes a resin mixture. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene; a second resin including polyphenylene ether resin modified by bismaleimide; a third resin block polymerized by a monomer mixture including styrene and butadiene; and an acenaphthylene.
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公开(公告)号:US20240228779A1
公开(公告)日:2024-07-11
申请号:US18170529
申请日:2023-02-17
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
CPC classification number: C08L79/04 , C08L71/12 , C08L79/08 , C08L2201/02 , C08L2205/025 , C08L2205/035
Abstract: A resin composition includes CE resin, BMI resin, and a modified polyphenylene ether resin has a following general formula:
wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.-
公开(公告)号:US20240150568A1
公开(公告)日:2024-05-09
申请号:US18184696
申请日:2023-03-16
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Hung-Yi Chang , Chia-Lin Liu , Wei-Ru Huang
IPC: C08L27/18
CPC classification number: C08L27/18 , C08L2201/08 , C08L2205/025
Abstract: The invention provides a high thermal conductivity fluororesin composition and products thereof. The high thermal conductivity fluororesin composition includes a polytetrafluoroethylene resin, a fluorine-containing copolymer, spherical inorganic fillers and impregnation aids.
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公开(公告)号:US20230279226A1
公开(公告)日:2023-09-07
申请号:US17740375
申请日:2022-05-10
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu , Chien Kai Wei
CPC classification number: C08L79/08 , C08G73/1032 , C08G73/105 , C08G73/1082 , C08G73/1042 , C08L2201/08 , C08L2201/10 , C08L2203/16
Abstract: A polyimide resin is obtained by polymerizing a modified polyphenylene ether resin with terminal amine groups and tetracarboxylic dianhydride. The polyimide has the following characteristics: the dissipation factor under 10 GHz electromagnetic wave is less than 0.0040; the water absorption rate is less than 0.3%; or, the temperature of glass transition is greater than 250° C.
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公开(公告)号:US20250011548A1
公开(公告)日:2025-01-09
申请号:US18448977
申请日:2023-08-14
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , HungFan Lee , Hng-Yi Chang , Wei-Ru Huang , Chia-Lin Liu
Abstract: A manufacturing method of a resin composition includes the following steps. An inorganic filler, a first solvent, and a dispersant are mixed, wherein a material of the dispersant is silane and/or polysiloxane including an organic-philic end and an inorganic-philic end, and the dispersant and the inorganic filler undergo a dealcoholization condensation reaction reaction to form a dispersion including a modified inorganic filler. The organic-philic end includes a carbonyl group, an epoxy group, and/or an amine group. Epoxy resin is dissolved into the dispersion.
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公开(公告)号:US20240417557A1
公开(公告)日:2024-12-19
申请号:US18357167
申请日:2023-07-24
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
Abstract: The invention provides a resin composition that may effectively increase glass transition temperature while maintaining low-k electrical specification. The resin composition includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene, and ethylene, a second resin including a bismaleimide-modified polyphenylene ether resin, a divinylbenzene crosslinking agent, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent.
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公开(公告)号:US20240166874A1
公开(公告)日:2024-05-23
申请号:US18300383
申请日:2023-04-13
Applicant: NAN YA PLASTICS CORPORATION
Inventor: Te-Chao Liao , Yu-Ting Liu , Hung-Yi Chang , Chia-Lin Liu , Wei-Ru Huang
IPC: C08L79/08 , C08K3/36 , C08K5/5415
CPC classification number: C08L79/08 , C08K3/36 , C08K5/5415 , C08L2205/025 , C08L2205/035
Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
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