RESIN COMPOSITION
    1.
    发明公开
    RESIN COMPOSITION 审中-公开

    公开(公告)号:US20240174849A1

    公开(公告)日:2024-05-30

    申请号:US18071629

    申请日:2022-11-30

    CPC classification number: C08L47/00 C08J5/244 C08J2347/00 C08J2471/12

    Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.

    RESIN COMPOSITION
    3.
    发明公开
    RESIN COMPOSITION 审中-公开

    公开(公告)号:US20240158632A1

    公开(公告)日:2024-05-16

    申请号:US18074526

    申请日:2022-12-05

    CPC classification number: C08L71/123 C08L2205/03

    Abstract: A resin composition is provided, which includes a novel low dielectric resin, a SBS resin, a cross-linking agent, a PPE resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low dielectric resin is a maleimide resin. With the formula, the resin composition may improve resin fluidity and glass transition temperature (Tg) while maintaining low dielectric, thereby enhancing the overall processability.

    MANUFACTURING METHOD OF RESIN COMPOSITION

    公开(公告)号:US20250011548A1

    公开(公告)日:2025-01-09

    申请号:US18448977

    申请日:2023-08-14

    Abstract: A manufacturing method of a resin composition includes the following steps. An inorganic filler, a first solvent, and a dispersant are mixed, wherein a material of the dispersant is silane and/or polysiloxane including an organic-philic end and an inorganic-philic end, and the dispersant and the inorganic filler undergo a dealcoholization condensation reaction reaction to form a dispersion including a modified inorganic filler. The organic-philic end includes a carbonyl group, an epoxy group, and/or an amine group. Epoxy resin is dissolved into the dispersion.

    RESIN COMPOSITION
    9.
    发明申请

    公开(公告)号:US20240417557A1

    公开(公告)日:2024-12-19

    申请号:US18357167

    申请日:2023-07-24

    Abstract: The invention provides a resin composition that may effectively increase glass transition temperature while maintaining low-k electrical specification. The resin composition includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene, and ethylene, a second resin including a bismaleimide-modified polyphenylene ether resin, a divinylbenzene crosslinking agent, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent.

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