Invention Publication
- Patent Title: SPATIALLY TUNABLE DEPOSITION TO COMPENSATE WITHIN WAFER DIFFERENTIAL BOW
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Application No.: US18427348Application Date: 2024-01-30
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Publication No.: US20240167161A1Publication Date: 2024-05-23
- Inventor: Fayaz A. Shaikh , Adriana Vintila , Matthew Mudrow , Nick Ray Linebarger, JR. , Xin Yin , James F. Lee , Brian Joseph Williams
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Main IPC: C23C16/458
- IPC: C23C16/458 ; C23C16/04 ; C23C16/44 ; C23C16/455 ; C23C16/509
Abstract:
A plasma processing chamber for depositing a film on an underside surface of a wafer, includes a showerhead pedestal. The showerhead pedestal includes a first zone and a second zone. The first zone is configured for depositing a first film to the underside surface of the wafer and the second zone is configured for depositing a second film to the underside surface of the wafer.
Information query
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