Invention Publication
- Patent Title: EQUIPMENT FRONT-END MODULES FOR SEMICONDUCTOR PROCESSING SYSTEMS AND METHODS OF MAKING SEMICONDUCTOR PROCESSING SYSTEMS
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Application No.: US18522132Application Date: 2023-11-28
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Publication No.: US20240178019A1Publication Date: 2024-05-30
- Inventor: Mandar Deshpande , Gurupkar Singh Nerwal , Joseph Kraus , Kyle Barrette
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/44 ; H01J37/32

Abstract:
An equipment front-end module (EFEM) includes a with a load port seat and a transfer robot seat. A fan filter unit is supported by the frame assembly and a controls box encloses the fan filter unit and is supported by the fan filter unit. The rear panel has a tunnel seat, is fixed to the frame assembly, and is separated from the load port seat by the transfer robot seat. One of (a) a plate body with an inboard passthrough and (b) a tunnel body with an outboard passthrough fixed at the tunnel seat and coupled to the frame assembly by the rear panel to space a process chamber with a quad chamber arrangement from the frame assembly differently along a transfer extending through the tunnel seat than a process module having a single or a dual chamber arrangement using a singular EFEM arrangement. Semiconductor processing systems and methods of making semiconductor processing systems are also described.
Information query
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