公开(公告)号：US20240178019A1

公开(公告)日：2024-05-30

申请号：US18522132

申请日：2023-11-28

Applicant: ASM IP Holding B.V.

Inventor： Mandar Deshpande ,  Gurupkar Singh Nerwal ,  Joseph Kraus ,  Kyle Barrette

IPC: H01L21/67 ,  C23C16/44 ,  H01J37/32

CPC classification number: H01L21/67196 ,  C23C16/4409 ,  H01J37/32743 ,  H01L21/67167 ,  H01L21/67201 ,  H01J2237/184 ,  H01J2237/332

Abstract: An equipment front-end module (EFEM) includes a with a load port seat and a transfer robot seat. A fan filter unit is supported by the frame assembly and a controls box encloses the fan filter unit and is supported by the fan filter unit. The rear panel has a tunnel seat, is fixed to the frame assembly, and is separated from the load port seat by the transfer robot seat. One of (a) a plate body with an inboard passthrough and (b) a tunnel body with an outboard passthrough fixed at the tunnel seat and coupled to the frame assembly by the rear panel to space a process chamber with a quad chamber arrangement from the frame assembly differently along a transfer extending through the tunnel seat than a process module having a single or a dual chamber arrangement using a singular EFEM arrangement. Semiconductor processing systems and methods of making semiconductor processing systems are also described.