公开(公告)号：US20230197472A1

公开(公告)日：2023-06-22

申请号：US18065869

申请日：2022-12-14

Applicant: ASM IP Holding, B.V.

Inventor： Joseph Kraus ,  Mario Gonzalez ,  Mandar Deshpande

IPC: H01L21/67 ,  C23C16/44

CPC classification number: H01L21/67063 ,  C23C16/4408 ,  H01L21/67167 ,  H01L21/67201

Abstract: A semiconductor processing system includes a front-end module connected to a load lock, a process module coupled to the front-end module by the load lock, a purge/vent fluid inlet conduit connected to the load lock, a heater element coupled to the load lock by the purge/vent fluid inlet conduit, and a controller. The controller is operably connected to the heater element and responsive to instructions recorded on a memory to transfer a substrate carrying substrate moisture from the front-end module into the load lock, heat a purge/vent fluid using the heater element, flow the heated purge/vent fluid into the load lock using the purge/vent fluid inlet conduit, remove the moisture from the load lock using the heated purge/vent fluid, and transfer the substrate from the load lock to the process module for processing using the process module. Moisture control methods and heated purge/vent fluid arrangements are also described.

公开(公告)号：US20250105705A1

公开(公告)日：2025-03-27

申请号：US18893498

申请日：2024-09-23

Applicant: ASM IP Holding B.V.

Inventor： Mario Gonzalez ,  Joseph Kraus ,  Dongyang Chen ,  Shaofeng Chen

IPC: H02K9/26 ,  B25J9/10 ,  H01L21/67 ,  H01L21/687 ,  H02K21/14

Abstract: A motor arrangement includes a stator body, a rotor body, a permanent magnet and a fluid conduit. The stator body defines a rotary axis and has a bore. The rotor body is supported for rotary movement about the rotary axis in the bore and is separated from the stator body by a gap. The permanent magnet is arranged within the gap and is fixed to one of the stator body and the rotor body. The fluid conduit is supported above the gap and has an outlet in fluid communication with the gap to separate the permanent magnet from an infiltrant fluid resident within an atmosphere above of the gap by issuing a barrier fluid into the atmosphere above the gap and gravimetrically flowing the barrier fluid into the gap. Semiconductor processing systems, barrier fluid kits, and methods of purging motor arrangements are also described.

公开(公告)号：US20240178033A1

公开(公告)日：2024-05-30

申请号：US18523172

申请日：2023-11-29

Applicant: ASM IP Holding B.V.

Inventor： Jithin Prabha ,  Joseph Kraus ,  Pawan Rao

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67742 ,  H01L21/67109 ,  H01L21/68707

Abstract: A substrate cooling apparatus includes a cooling plate with a top surface including an array of embedded substrate support members protruding therefrom. A channel is disposed in an underside portion of the cooling plate, the conduit is embedded in the channel, a conduit comprising a coolant inlet at a first end and a coolant outlet at a second end, and a viscous thermally conductive material is disposed in the channel and is thermally coupled to an interior surface of the channel and an exterior surface of the conduit. One or more open recesses are disposed in a top surface of the cooling plate extending inward from a perimeter of the cooling plate toward a center point of the cooling plate, the open recesses disposed circumferentially on diametrically opposite sides of the cooling plate wherein the open recesses are sized to receive a corresponding substrate handling member of an indexer. Substrate transfer systems, cooling plate arrangements, and substrate transfer methods are also described.

公开(公告)号：US20240178019A1

公开(公告)日：2024-05-30

申请号：US18522132

申请日：2023-11-28

Applicant: ASM IP Holding B.V.

Inventor： Mandar Deshpande ,  Gurupkar Singh Nerwal ,  Joseph Kraus ,  Kyle Barrette

IPC: H01L21/67 ,  C23C16/44 ,  H01J37/32

CPC classification number: H01L21/67196 ,  C23C16/4409 ,  H01J37/32743 ,  H01L21/67167 ,  H01L21/67201 ,  H01J2237/184 ,  H01J2237/332

Abstract: An equipment front-end module (EFEM) includes a with a load port seat and a transfer robot seat. A fan filter unit is supported by the frame assembly and a controls box encloses the fan filter unit and is supported by the fan filter unit. The rear panel has a tunnel seat, is fixed to the frame assembly, and is separated from the load port seat by the transfer robot seat. One of (a) a plate body with an inboard passthrough and (b) a tunnel body with an outboard passthrough fixed at the tunnel seat and coupled to the frame assembly by the rear panel to space a process chamber with a quad chamber arrangement from the frame assembly differently along a transfer extending through the tunnel seat than a process module having a single or a dual chamber arrangement using a singular EFEM arrangement. Semiconductor processing systems and methods of making semiconductor processing systems are also described.