Invention Publication
- Patent Title: Arrangement of Power-Grounds in Package Structures
-
Application No.: US18428934Application Date: 2024-01-31
-
Publication No.: US20240178177A1Publication Date: 2024-05-30
- Inventor: Ting-Yu Yeh , Chun-Hua Chang , Fong-Yuan Chang , Jyh Chwen Frank Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- The original application number of the division: US17394213 2021.08.04
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56

Abstract:
A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.
Information query
IPC分类: