Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include an interposer having a surface, wherein a material of the interposer includes glass and the interposer includes through-glass vias (TGVs); a photonic integrated circuit (PIC) optically coupled to the surface of the interposer by optical glue or fusion bonding and electrically coupled to the TGVs in the interposer by hybrid bond interconnects; and an optical component optically coupled to the interposer, wherein the optical component is optically coupled to the PIC by an optical pathway through the interposer.