HERMETIC PACKAGE DEVICE AND DEVICE MODULE
摘要:
A hermetic package device comprises a device wafer in which a semiconductor circuit and bonding pads are provided on a mounting surface, a lid wafer arranged to be opposed to the device wafer, and a sealing part that forms an hermetically sealed space in a vacuum atmosphere to house the semiconductor circuit between the device wafer and the lid wafer. A second installation region in which the bonding pads are provided in the mounting surface protrudes relative to the lid wafer, and an outer surface of a portion in the sealing part facing the second installation region is inclined such that a position thereon approaches the second installation region when getting closer from the device wafer toward the lid wafer.
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