- 专利标题: HERMETIC PACKAGE DEVICE AND DEVICE MODULE
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申请号: US18551178申请日: 2021-05-12
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公开(公告)号: US20240178247A1公开(公告)日: 2024-05-30
- 发明人: Yusuke YAMAGATA , Takayuki KATO , Tomohiro MAEGAWA , Yoshinori TAKAHASHI
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 国际申请: PCT/JP2021/018068 2021.05.12
- 进入国家日期: 2023-09-18
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
A hermetic package device comprises a device wafer in which a semiconductor circuit and bonding pads are provided on a mounting surface, a lid wafer arranged to be opposed to the device wafer, and a sealing part that forms an hermetically sealed space in a vacuum atmosphere to house the semiconductor circuit between the device wafer and the lid wafer. A second installation region in which the bonding pads are provided in the mounting surface protrudes relative to the lid wafer, and an outer surface of a portion in the sealing part facing the second installation region is inclined such that a position thereon approaches the second installation region when getting closer from the device wafer toward the lid wafer.
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