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1.发明申请公开(公告)号：US20200271527A1
公开(公告)日：2020-08-27
申请号：US16603103
申请日：2018-01-29
发明人： Tomohiro MAEGAWA
IPC分类号： G01J5/20 , G01J5/02 , H01L27/146
摘要： This infrared imaging element includes: a substrate which has a front surface and a back surface and to which a circuit unit is provided; a support leg wiring line that is disposed above the front surface of the substrate; and an infrared-ray detection unit which is held on the support leg wiring line and to which a diode electrically connected to the circuit unit via the support leg wiring line is provided, wherein the temperature change of the infrared-ray detection unit is detected as an electrical signal change of the diode by the circuit unit. The substrate, the support leg wiring line, and the infrared-ray detection unit are laminated at intervals in a direction perpendicular to the front surface of the substrate.
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公开(公告)号：US20230204428A1
公开(公告)日：2023-06-29
申请号：US17996180
申请日：2020-06-02
发明人： Tomohiro MAEGAWA
摘要： This infrared imaging device includes: an infrared transmission lens which collects infrared light emitted from an object; an infrared imaging element having a screen in which pixels for converting infrared light collected by the infrared transmission lens to electric signals are arranged in a two-dimensional array; a signal processing unit which converts electric signals from the infrared imaging element to digital signals; an optical characteristics correction unit which performs optical characteristics correction for an output of the signal processing unit on the basis of non-image-formation information set in advance for the infrared transmission lens; a reference temperature detection unit which detects a reference temperature; and a temperature measurement unit which performs absolute temperature conversion for the object on the basis of an output of the optical characteristics correction unit and an output of the reference temperature detection unit.
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公开(公告)号：US20220159199A1
公开(公告)日：2022-05-19
申请号：US17434358
申请日：2019-06-12
发明人： Tomohiro MAEGAWA , Hiroshi HIROSAKI
IPC分类号： H04N5/33 , G01K1/14 , G01J5/0804
摘要： An infrared imaging device comprises an infrared imaging sensor to detect infrared light as heat, a temperature drift compensation amount calculator to calculate a temperature drift compensation amount in accordance with a temperature change of the substrate, with respect to a pixel output outputted from each of the plurality of pixels, a compensation amount calculation function generator to generate a function with the temperature of the substrate as an independent variable; and a timing controller to cause the infrared imaging sensor and the substrate temperature sensor to synchronously output data to the compensation amount calculation function generator for generating the function, wherein the compensation amount calculation function generator uses the data for generation output after the generation of the function as additional data for improving accuracy of the function.
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公开(公告)号：US20240178247A1
公开(公告)日：2024-05-30
申请号：US18551178
申请日：2021-05-12
IPC分类号： H01L27/146
CPC分类号： H01L27/14618
摘要： A hermetic package device comprises a device wafer in which a semiconductor circuit and bonding pads are provided on a mounting surface, a lid wafer arranged to be opposed to the device wafer, and a sealing part that forms an hermetically sealed space in a vacuum atmosphere to house the semiconductor circuit between the device wafer and the lid wafer. A second installation region in which the bonding pads are provided in the mounting surface protrudes relative to the lid wafer, and an outer surface of a portion in the sealing part facing the second installation region is inclined such that a position thereon approaches the second installation region when getting closer from the device wafer toward the lid wafer.
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公开(公告)号：US20220181220A1
公开(公告)日：2022-06-09
申请号：US17600786
申请日：2019-08-20
发明人： Tomohiro MAEGAWA
摘要： A device (2) is formed on a main surface of a semiconductor substrate (1). A passivation film (5) covers the main surface. A metallized pattern (6) is formed on the passivation film (5) and surrounds the device (2). A sealing metal layer (7) is formed on the metallized pattern (6) and includes a corner portion (10) in a planar view. A lid (8) is bonded to the metallized pattern (6) with the sealing metal layer (7) interposed therebetween and vacuum-seals the device (2). A dummy wiring (11) is softer than the metallized pattern (6), is formed at least between an outer portion of the corner portion of the sealing metal layer (7) and the semiconductor substrate (1), and does not electrically connected to the device (2).
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公开(公告)号：US20210190366A1
公开(公告)日：2021-06-24
申请号：US16981674
申请日：2019-01-28
发明人： Tomohiro MAEGAWA , Daisuke FUJISAWA
摘要： A thermal infrared imaging element includes: a pixel array unit (100) that includes a plurality of temperature detection pixels (3) each of which includes a diode (1) and generates an electric signal in accordance with infrared rays received from an outside, the temperature detection pixels being arrayed in a two-dimensional fashion in a row and column directions; a plurality of drive lines (12) that are provided in rows and that commonly connect one ends of the temperature detection pixels (3) in units of the rows; a plurality of signal lines (13) that are provided in columns and that commonly connect the other ends of the temperature detection pixels (3) in units of the columns; a vertical scanning circuit (4) that sequentially selects the drive lines; a signal line selection circuit (6) that sequentially selects the signal lines; and one or more read circuits (7) that amplify an electric signal from a temperature detection pixel connected to both one of the drive lines which is selected by the vertical scanning circuit and one of the signal lines which is selected by the signal line selection circuit. The number of the read circuits (7) is smaller than the number of the signal lines provided in the respective columns.
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公开(公告)号：US20230145676A1
公开(公告)日：2023-05-11
申请号：US17995830
申请日：2020-08-18
IPC分类号： G01J5/12
CPC分类号： G01J5/12 , G01J2005/123
摘要： A sensor chip (4) having a pixel unit (8) that detects an infrared ray is bonded to an insulating substrate (2) using a bonding material (3). A heat generation mechanism (11) is integrated with the sensor chip (4). A control unit (14) is provided on the insulating substrate (2) and controls an amount of current to be supplied to the heat generation mechanism (11).
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公开(公告)号：US20220238587A1
公开(公告)日：2022-07-28
申请号：US17620193
申请日：2019-08-27
发明人： Yutaka YONEDA , Akihiro MATSUSUE , Kento MORI , Tomohiro MAEGAWA
IPC分类号： H01L27/146 , G02B7/02 , H01L23/544
摘要： An optical sensor module comprises a substrate, a photodetector which detects light and is fixed to the substrate and a lens holding member, to which a lens is fixed, which is fixed to the substrate at a position surrounding the photodetector, and the lens is fixed in the state in which an outer circumference of the lens is covered by a material itself of the lens holding member, and a part of an outer edge of the lens is exposed at a side of an outer surface of the lens holding member or at a side of an inner surface of the lens holding member.
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9.发明申请公开(公告)号：US20200059610A1
公开(公告)日：2020-02-20
申请号：US16082097
申请日：2017-02-07
发明人： Tomohiro MAEGAWA
IPC分类号： H04N5/33 , G01J5/10 , H01L27/146 , H04N5/378
摘要： An infrared imaging element includes a photosensitive pixel array and a driving line for each photosensitive pixel. The infrared imaging element includes a vertical scanning circuit, a signal line, a bias line, a differential integration circuit that time-integrates a difference between a voltage across the first constant current source and a voltage across the second constant current source; a horizontal scanning circuit; a reference pixel array that outputs a reference signal changing in accordance with a change in a temperature of photosensitive pixels; a bias generating circuit that generates a bias voltage for applying the bias voltage to the bias line, the bias voltage corresponding to a difference between a reference voltage and a differential signal between the reference signal and a voltage on the bias line; and a voltage generating circuit that generates a temperature signal generation voltage based on the bias voltage.
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