-
公开(公告)号：US20200169207A1
公开(公告)日：2020-05-28
申请号：US16604857
申请日：2017-07-07
IPC分类号： H02P25/18 , H02P27/08 , H02P29/00 , H02M7/5387 , F25B49/02
摘要： A motor drive system can detect a misconnection. A motor drive system for driving a motor including a plurality of stator windings includes: an inverter that converts a DC voltage supplied from a DC voltage source into an AC voltage and applies the AC voltage to the motor; a connection switching device that is disposed between the inverter and the motor and can switch a connection state of the stator windings; and a controller that performs abnormality determination on a connection state of the connection switching device on the basis of a current value of a current flowing in each of the stator windings.
-
公开(公告)号：US20240178247A1
公开(公告)日：2024-05-30
申请号：US18551178
申请日：2021-05-12
IPC分类号： H01L27/146
CPC分类号： H01L27/14618
摘要： A hermetic package device comprises a device wafer in which a semiconductor circuit and bonding pads are provided on a mounting surface, a lid wafer arranged to be opposed to the device wafer, and a sealing part that forms an hermetically sealed space in a vacuum atmosphere to house the semiconductor circuit between the device wafer and the lid wafer. A second installation region in which the bonding pads are provided in the mounting surface protrudes relative to the lid wafer, and an outer surface of a portion in the sealing part facing the second installation region is inclined such that a position thereon approaches the second installation region when getting closer from the device wafer toward the lid wafer.
-
搜索结果
2 条记录 (耗时 0.015 秒)
