公开(公告)号：US20230145676A1

公开(公告)日：2023-05-11

申请号：US17995830

申请日：2020-08-18

申请人： Mitsubishi Electric Corporation

发明人： Yoshinori TAKAHASHI ,  Tomohiro MAEGAWA

IPC分类号： G01J5/12

CPC分类号： G01J5/12 ,  G01J2005/123

摘要： A sensor chip (4) having a pixel unit (8) that detects an infrared ray is bonded to an insulating substrate (2) using a bonding material (3). A heat generation mechanism (11) is integrated with the sensor chip (4). A control unit (14) is provided on the insulating substrate (2) and controls an amount of current to be supplied to the heat generation mechanism (11).

公开(公告)号：US20180069641A1

公开(公告)日：2018-03-08

申请号：US15453422

申请日：2017-03-08

申请人： Mitsubishi Electric Corporation

发明人： Yoshinori TAKAHASHI

IPC分类号： H04B17/16

CPC分类号： H04B17/16 ,  G01R31/2822 ,  G01R31/2851 ,  G01R31/317 ,  G01R31/31716 ,  G01R31/31937 ,  H04B17/13

摘要： An integrated circuit according to the present invention includes a transmission circuit that transmits a millimeter wave signal, a detection section that detects the millimeter wave signal, an output terminal connected to an output of the transmission circuit via a first wire, a detection terminal provided adjacent to the output terminal and connected to an input of the detection section via a second wire, a first grounding terminal provided adjacent to the output terminal and connected to the transmission circuit via a first grounding wire for grounding the transmission circuit and a second grounding terminal provided adjacent to the detection terminal and connected to the detection section via a second grounding wire for grounding the detection section, wherein the first grounding wire and the second grounding wire are arranged around the first wire and the second wire.

公开(公告)号：US20240178247A1

公开(公告)日：2024-05-30

申请号：US18551178

申请日：2021-05-12

申请人： Mitsubishi Electric Corporation

发明人： Yusuke YAMAGATA ,  Takayuki KATO ,  Tomohiro MAEGAWA ,  Yoshinori TAKAHASHI

IPC分类号： H01L27/146

CPC分类号： H01L27/14618

摘要： A hermetic package device comprises a device wafer in which a semiconductor circuit and bonding pads are provided on a mounting surface, a lid wafer arranged to be opposed to the device wafer, and a sealing part that forms an hermetically sealed space in a vacuum atmosphere to house the semiconductor circuit between the device wafer and the lid wafer. A second installation region in which the bonding pads are provided in the mounting surface protrudes relative to the lid wafer, and an outer surface of a portion in the sealing part facing the second installation region is inclined such that a position thereon approaches the second installation region when getting closer from the device wafer toward the lid wafer.

公开(公告)号：US20210036422A1

公开(公告)日：2021-02-04

申请号：US16964275

申请日：2018-05-14

申请人： Mitsubishi Electric Corporation

发明人： Yoshinori TAKAHASHI

IPC分类号： H01Q3/36

摘要： A plurality of reception modules (1a,1b) receive signals from a plurality of antennas (2a,2b) respectively. A synthesizer (3) synthesizes output signals of the plurality of reception modules (1a,1b). Each of the plurality of reception modules (1a, 1b) includes a first sample-and-hold circuit (7a,7b) sampling and holding a received signal, a second sample-and-hold circuit (8a,8b) sampling and holding an output signal of the first sample-and-hold circuit (7a,7b), and a controller (9a,9b) controlling a timing at which the first sample-and-hold circuit (7a,7b) samples and holds the signal. Operation timings of the first sample-and-hold circuits (7a,7b) are set for the respective reception modules (1a,1b). Operation timings of the second sample-and-hold circuits (8a,8b) of the plurality of reception modules (1a,1b) are same.