Invention Publication
- Patent Title: Latency Events in Multi-Die Architecture
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Application No.: US18438665Application Date: 2024-02-12
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Publication No.: US20240184355A1Publication Date: 2024-06-06
- Inventor: Inder M. Sodhi , Achmed R. Zahir , Lior Zimet , Liran Fishel , Omri Flint , Ami Schwartzman
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: G06F1/3296
- IPC: G06F1/3296 ; G06F1/3206

Abstract:
Techniques are disclosed that pertain to synchronizing power states between integrated circuit dies. A system includes an integrated circuit that includes a plurality of integrated circuit dies coupled together. A particular integrated circuit die may include a primary power manager circuit and one or more remaining integrated circuit dies include respective secondary power manager circuits. The primary power manager circuit is configured to issue a transition request to the secondary power manager circuits to transition their integrated circuit dies from a first power state to a second power state. A given secondary power manager circuit is configured to receive the transition request, transition its integrated circuit die to the second power state, and issue an acknowledgement to the primary power manager circuit that its integrated circuit die has been transitioned to the second power state. Techniques are further disclosed relating to managing latency tolerance events within a multi-die integrated circuit.
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